Induction welding using a heat sink and/or cooling
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
1. A heat sink for use in induction welding, the heat sink comprising:
a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec;
a joint flexibly joining the tiles together at the edges, wherein the joint is comprised of a silicone; and
a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink.
2. The heat sink of claim 1 , wherein the tiles are comprised of Aluminum nitride.
3. The heat sink of claim 1 , wherein the tiles are comprised of Beryllium Oxide.
4. The heat sink of claim 1 , wherein the tiles are arranged in a single layer.
5. The heat sink of claim 1 , wherein the tiles define a gap therebetween and the joint is disposed within the gap.
6. The heat sink of claim 5 , wherein the gap is between about 0.005 inches to about 0.1 inches.
7. The heat sink of claim 1 , wherein the silicone has a long-term degradation temperature greater than about 400 degrees Fahrenheit in vacuum or air.
8. The heat sink of claim 7 , wherein the silicone has an elongation of between 12% and 670%.
9. The heat sink of claim 7 , wherein the silicone has a tear strength of between 31 lb/in and 190 lb/in.
10. The heat sink of claim 1 , wherein the tiles have a thermal conductivity of greater than about 75 W/mK.
11. The heat sink of claim 1 , wherein the tiles have a specific heat capacity of greater than about 500 J/K/kg.
12. The heat sink of claim 1 , wherein the joint is cured.
13. The heat sink of claim 1 , wherein the tiles and the joint have a thickness of less than 8 mm.
14. The heat sink of claim 13 , wherein the tiles and the joint have a thickness of 4 mm.
15. The heat sink of claim 1 , wherein the fluid channels in the tiles and the joint are connected in series.
16. The heat sink of claim 1 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink.
17. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.042 inches.
18. The heat sink of claim 1 , wherein the fluid channels have a diameter of about 0.082 inches.
19. The heat sink of claim 1 , further comprising a manifold connected to the fluid channels.
20. The heat sink of claim 19 , wherein the manifold includes a port that communicates with the fluid path.
21. A heat sink for use in induction welding, the heat sink comprising:
a number of tiles each having edges, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm 2 /sec;
a joint flexibly joining the tiles together at the edges, wherein the tiles define a gap therebetween and the joint is disposed within the gap and the gap is between about 0.005 inches to about 0.1 inches; and
a fluid path defined by fluid channels disposed within the tiles and the joint for communicating a coolant through the heat sink.
22. The heat sink of claim 21 , wherein the tiles are arranged in a single layer.
23. The heat sink of claim 21 , wherein the joint is cured.
24. The heat sink of claim 21 , wherein the fluid channels in the tiles and the joint are connected in series.
25. The heat sink of claim 21 , further comprising multiple fluid paths, wherein the multiple fluid paths are unidirectional and parallel to one another relative to the heat sink.
26. The heat sink of claim 21 , further comprising a manifold connected to the fluid channels, wherein the manifold includes a port that communicates with the fluid path.