Semiconductor device and method of manufacturing a semiconductor device
An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.
1. An electronic device comprising:
an electronic component comprising a first component side; a second component side; and a lateral component side that extends between the first and second component sides;
a redistribution structure (RDS) comprising a first RDS side, a second RDS side, and a lateral RDS side that extends between the first and second RDS sides, wherein the second component side is coupled to the first RDS side;
an encapsulant that covers at least a portion of the second RDS side and laterally surrounds at least a portion of the electronic component;
an electromagnetic interference (EMI) shield that covers at least a portion of the first component side and laterally surrounds at least a portion of the electronic component, wherein the EMI shield comprises an inner shield surface, and wherein a bottom of the EMI shield is exposed from the encapsulant; and
a conductive strap comprising a first strap end coupled to the redistribution structure, and a second strap end coupled to the inner shield surface.
2. The electronic device of claim 1 , wherein the encapsulant contacts the conductive strap.
3. The electronic device of claim 1 , wherein the conductive strap extends from the redistribution structure through the encapsulant to the inner shield surface.
4. The electronic device of claim 3 , wherein the encapsulant comprises a horizontal encapsulant side below the second RDS side, and the second strap end is exposed from the encapsulant at the horizontal encapsulant side.
5. The electronic device of claim 1 , wherein the encapsulant comprises an ablated encapsulant surface, and the second strap end is exposed from the encapsulant at the ablated encapsulant surface.
6. The electronic device of claim 5 , wherein the ablated encapsulant surface comprises a laser-ablated surface.
7. The electronic device of claim 1 , wherein the encapsulant laterally surrounds the redistribution structure.
8. The electronic device of claim 1 , wherein
the encapsulant comprises a first encapsulant side, and a second encapsulant side that faces a same direction as the second RDS side.
9. The electronic device of claim 8 , wherein:
the EMI shield covers at least a portion of the second encapsulant side; and
the second strap end is coupled to the inner shield surface at the second encapsulant side.
10. An electronic device comprising:
an electronic component comprising a first component side; a second component side; and a lateral component side that extends between the first and second component sides;
a redistribution structure (RDS) comprising a first RDS side, a second RDS side, and a lateral RDS side that extends between the first and second RDS sides, wherein the second component side is coupled to the first RDS side;
an encapsulant that covers at least a portion of the second RDS side and laterally surrounds at least a portion of the electronic component;
an electromagnetic interference (EMI) shield that covers at least a portion of the first component side and laterally surrounds at least a portion of the electronic component; and
a conductive strap comprising a first strap end coupled to the second RDS side, and a second strap end coupled to the EMI shield,
wherein a bottommost surface of the EMI shield is devoid of the second strap end.
11. The electronic device of claim 10 , wherein the conductive strap comprises a wire.
12. The electronic device of claim 11 , wherein:
the redistribution structure comprises a pad on the second RDS side; and
the wire is connected to the pad with a solderless connection.
13. The electronic device of claim 10 , wherein the conductive strap follows a partial arch path from the second RDS side.
14. The electronic device of claim 10 , wherein the first strap end comprises a first horizontal surface, the second strap end comprises a second horizontal surface, and the second strap end coupled to the EMI shield is below the first strap end coupled to the second RDS side.
15. The electronic device of claim 10 , wherein the second strap end is laterally displaced relative the RDS and vertically displaced below the RDS.
16. The electronic device of claim 10 , comprising an interconnect structure for connecting the electronic device to another electrical component, and wherein the redistribution structure comprises:
a first pad on the second RDS side and coupled to the first strap end; and
a second pad on the second RDS side and coupled to the interconnect structure.
17. The electronic device of claim 10 , wherein the electronic component comprises a semiconductor die.
18. A method of manufacturing an electronic device, the method comprising:
providing a first structure comprising:
an electronic component comprising a first component side, a second component side, and a lateral component side that extends between the first and second component sides; and
a redistribution structure (RDS) comprising an first RDS side, a second RDS side, and a lateral RDS side that extends between the first and second RDS sides, wherein the second component side is coupled to the first RDS side;
providing a conductive strap comprising a first strap end and a second strap end, the first strap end coupled to the redistribution structure;
providing an encapsulant that covers at least a portion of the second RDS side and laterally surrounds at least a portion of the electronic component; and
providing an electromagnetic interference (EMI) shield that covers at least a portion of the first component side and laterally surrounds at least a portion of the electronic component, wherein the EMI shield comprises an inner shield surface coupled to the second strap end, and wherein a bottom of the EMI shield is exposed from the encapsulant.
19. The method of claim 18 , wherein providing the encapsulant comprises forming the encapsulant to contact and surround the conductive strap.
20. The method of claim 18 , comprising exposing the second strap end from the encapsulant by, at least in part, laser-ablating a portion of the encapsulant.