Access line formation for a memory array
Methods, systems, and devices for access line formation for a memory array are described. The techniques described herein may be used to fabricate access lines for one or more decks of a memory array. In some examples, one or more access lines of a deck may be formed using an independent processing step. For example, different fabrication processes may be used to form a plurality of access lines in a deck and to form the pillars (e.g., the memory cells) that are coupled with the access lines. In some examples, an offset between the access lines and the pillars may exist due to the components being fabricated in different processing steps.
1. A method, comprising:
etching, based at least in part on a first mask, a first conductive material in a first direction to form a plurality of first conductive lines;
depositing, after etching the first conductive material, a stack of materials on the plurality of first conductive lines, the stack of materials comprising a chalcogenide material;
etching, after depositing the stack of materials, the stack of materials in the first direction to form a plurality of lines;
depositing a second conductive material on the stack of materials; and
etching, based at least in part on a second mask different from the first mask, the second conductive material and the plurality of lines in a second direction to form a plurality of pillars and a plurality of second conductive lines.
2. The method of claim 1 , wherein depositing the stack of materials comprises:
depositing a first electrode material above the plurality of first conductive lines;
depositing the chalcogenide material above the first electrode material; and
depositing a second electrode material above the chalcogenide material, wherein the second electrode material is in contact with the second conductive material.
3. The method of claim 1 , wherein depositing the stack of materials comprises:
depositing a first electrode material above the plurality of first conductive lines;
depositing a selector material above the first electrode material;
depositing a second electrode material above the selector material;
depositing the chalcogenide material above the second electrode material; and
depositing a third electrode material above the chalcogenide material, wherein the third electrode material is in contact with the second conductive material.
4. The method of claim 1 , further comprising:
depositing a dielectric material between the plurality of first conductive lines; and
removing, before depositing the stack of materials, a portion of the first conductive material and the dielectric material, wherein an upper surface of the first conductive material is co-planar with an upper surface of the dielectric material based at least in part on the removing.
5. The method of claim 4 , wherein a lower surface of a pillar of the plurality of pillars is in contact with a portion of the dielectric material.
6. The method of claim 4 , further comprising:
depositing a sealing material between the plurality of first conductive lines after etching the first conductive material; and
etching at least a portion of the sealing material between the plurality of first conductive lines, wherein the sealing material separates the dielectric material from the plurality of first conductive lines based at least in part on the etching.
7. The method of claim 1 , further comprising:
depositing a sealing material between the plurality of lines; and
etching at least a portion of the sealing material between the plurality of lines, wherein the sealing material is coupled with a sidewall of a line of the plurality of lines.
8. The method of claim 7 , further comprising:
depositing a dielectric material between the plurality of lines, wherein the sealing material separates the dielectric material from the plurality of lines; and
removing a portion of the stack of materials, the sealing material, and the dielectric material, wherein a lower surface of the second conductive material is in contact with an upper surface of the stack of materials, the sealing material, and the dielectric material based at least in part on the removal.
9. The method of claim 1 , further comprising:
depositing the first conductive material before etching the first conductive material to form the plurality of first conductive lines.
10. The method of claim 1 , further comprising:
depositing a second stack of materials above the second conductive material, the stack of materials comprising the chalcogenide material and a third conductive material; and
etching the second stack of materials and the third conductive material in the first direction to form a plurality of second pillars.
11. The method of claim 10 , wherein a first sidewall and a second sidewall of the plurality of second pillars is aligned with a respective first sidewall and a respective second sidewall of the plurality of pillars in the second direction.
12. The method of claim 1 , further comprising:
depositing a second stack of materials above the second conductive material;
etching the second stack of materials in the first direction to form a second plurality of lines;
depositing a dielectric material between the second plurality of lines;
masking at least a portion of a top surface of the second stack of materials and the dielectric material;
depositing a third conductive material above the second stack of materials and the dielectric material;
etching the third conductive material in the first direction to form a plurality of third conductive lines; and
etching the second stack of materials, the dielectric material, and the plurality of third conductive lines in the second direction to form a plurality of second pillars.
13. A manufacturing system, comprising:
one or more controllers configured to execute a set of instructions to cause one or more functional elements of the manufacturing system to:
etch, based at least in part on a first mask, a first conductive material in a first direction to form a plurality of first conductive lines;
deposit, after etching the first conductive material, a stack of materials on the plurality of first conductive lines, the stack of materials comprising a chalcogenide material;
etch, after depositing the stack of materials, the stack of materials in the first direction to form a plurality of lines;
deposit a second conductive material on the stack of materials; and
etch, based at least in part on a second mask different from the first mask, the second conductive material and the plurality of lines in a second direction to form a plurality of pillars and a plurality of second conductive lines.
14. The manufacturing system of claim 13 , wherein, to deposit the stack of materials, the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a first electrode material above the plurality of first conductive lines;
deposit the chalcogenide material above the first electrode material; and
deposit a second electrode material above the chalcogenide material, wherein the second electrode material is in contact with the second conductive material.
15. The manufacturing system of claim 13 , wherein, to deposit the stack of materials, the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a first electrode material above the plurality of first conductive lines;
deposit a selector material above the first electrode material;
deposit a second electrode material above the selector material;
deposit the chalcogenide material above the second electrode material; and
deposit a third electrode material above the chalcogenide material, wherein the third electrode material is in contact with the second conductive material.
16. The manufacturing system of claim 13 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a dielectric material between the plurality of first conductive lines; and
remove, before depositing the stack of materials, a portion of the first conductive material and the dielectric material, wherein an upper surface of the first conductive material is co-planar with an upper surface of the dielectric material based at least in part on the removing.
17. The manufacturing system of claim 16 , wherein a lower surface of a pillar of the plurality of pillars is in contact with a portion of the dielectric material.
18. The manufacturing system of claim 16 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a sealing material between the plurality of first conductive lines after etching the first conductive material; and
etch at least a portion of the sealing material between the plurality of first conductive lines, wherein the sealing material separates the dielectric material from the plurality of first conductive lines based at least in part on the etching.
19. The manufacturing system of claim 13 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a sealing material between the plurality of lines; and
etch at least a portion of the sealing material between the plurality of lines, wherein the sealing material is coupled with a sidewall of a line of the plurality of lines.
20. The manufacturing system of claim 19 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a dielectric material between the plurality of lines, wherein the sealing material separates the dielectric material from the plurality of lines; and
remove a portion of the stack of materials, the sealing material, and the dielectric material, wherein a lower surface of the second conductive material is in contact with an upper surface of the stack of materials, the sealing material, and the dielectric material based at least in part on the removal.
21. The manufacturing system of claim 13 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit the first conductive material before etching the first conductive material to form the plurality of first conductive lines.
22. The manufacturing system of claim 13 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a second stack of materials above the second conductive material, the stack of materials comprising the chalcogenide material and a third conductive material; and
etch the second stack of materials and the third conductive material in the first direction to form a plurality of second pillars.
23. The manufacturing system of claim 22 , wherein a first sidewall and a second sidewall of the plurality of second pillars is aligned with a respective first sidewall and a respective second sidewall of the plurality of pillars in the second direction.
24. The manufacturing system of claim 13 , wherein the one or more controllers are configured to execute the set of instructions to cause one or more functional elements of the manufacturing system to:
deposit a second stack of materials above the second conductive material;
etch the second stack of materials in the first direction to form a second plurality of lines;
deposit a dielectric material between the second plurality of lines;
mask at least a portion of a top surface of the second stack of materials and the dielectric material;
deposit a third conductive material above the second stack of materials and the dielectric material;
etch the third conductive material in the first direction to form a plurality of third conductive lines; and
etch the second stack of materials, the dielectric material, and the plurality of third conductive lines in the second direction to form a plurality of second pillars.
25. A method, comprising:
forming a plurality of first conductive lines based at least in part on etching a first conductive material in a first direction;
forming a plurality of lines based at least in part on depositing a stack of materials on the formed plurality of first conductive lines, the stack of materials comprising a chalcogenide material, and etching the stack of materials in the first direction; and
forming a plurality of pillars and a plurality of second conductive lines based at least in part on depositing a second conductive material on the formed plurality of lines and etching the second conductive material and the plurality of lines in a second direction.
26. The method of claim 25 , further comprising:
depositing a dielectric material between the plurality of first conductive lines; and
removing, before depositing the stack of materials, a portion of the first conductive material and the dielectric material, wherein an upper surface of the first conductive material is co-planar with an upper surface of the dielectric material based at least in part on the removing.
27. The method of claim 25 , further comprising:
forming a plurality of second pillars based at least in part on depositing a second stack of materials above the second conductive material, the stack of materials comprising the chalcogenide material, and etching the second stack of materials in the first direction; and
forming a plurality of third conductive lines based at least in part on depositing a third conductive material on the formed plurality of second pillars and etching the third conductive material in the first direction.