Signal routing carrier
An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.
1. An article comprising:
a substrate;
a semiconductor die thereon;
a routing carrier attached to the substrate; and
a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier,
wherein the transmission pathway has a loss of no more than 2.5 dB at a signaling speed of about 50 Gbpa to about 250 Gbps.
2. The article of claim 1 , wherein the routing carrier is attached to a surface of the substrate.
3. The article of claim 1 , wherein the routing carrier is embedded within the substrate.
4. The article of claim 1 , wherein the routing carrier is a high-speed signal routing carrier.
5. The article of claim 1 , wherein the routing carrier comprises a single-ended interface.
6. The article of claim 1 , wherein the substrate comprises a plurality of dielectric layers interspersed with conductive traces.
7. The article of claim 6 , wherein one or more of the conductive traces is electrically connected to the transmission pathway.
8. The article of claim 1 , wherein the routing carrier comprises a ceramic, a glass, a glass ceramic, or an organic substrate.
9. The article of claim 1 , wherein the routing carrier comprises a serializer deserializer (SerDes).
10. The article of claim 1 , wherein the routing carrier comprises a single-ended interface.