Curable composition and resin for treatment of a subterranean formation

1. A curable composition for treatment of a subterranean formation, the curable composition comprising:

an epoxy monomer and a hardener, wherein the epoxy monomer is an epoxy silane monomer configured to be curable by the hardener; and

a carrier fluid,

wherein the epoxy monomer is an epoxy silane monomer selected from

wherein about 55 wt. % to about 70 wt. % of the curable composition is the epoxy silane monomer;

wherein the hardener is

wherein n is about 1 to about 4,

wherein about 15 wt. % to about 35 wt. % of the curable composition is the hardener; and

wherein the carrier fluid comprises water, wherein about 5 wt. % to about 25 wt. % of the curable composition is the carrier fluid.

2. The curable composition of claim 1 , wherein the curable composition further comprises a downhole fluid.

3. The curable composition of claim 1 , wherein the curable composition is a composition for at least one of remediating and consolidating a subterranean formation.

4. The curable composition of claim 1 , wherein the curable composition is a composition for at least one of cementing and plugging a subterranean formation.

5. An epoxy silane resin cured reaction product of the curable composition of claim 1 .

6. The epoxy silane resin cured reaction product of claim 5 , wherein the epoxy silane resin cured product is adhered to a casing disposed in the subterranean formation.

7. The curable composition of claim 1 , wherein an epoxy silane resin reaction product of the curable composition is effective for adhering to a casing disposed in the subterranean formation, thereby cementing or plugging the subterranean formation.

8. The curable composition of claim 1 , wherein the carrier fluid comprises water including at least one of fresh water, brine, produced water, flowback water, brackish water, and sea water.

9. The curable composition of claim 1 , wherein the carrier fluid comprises crude oil, dipropylene glycol methyl ether, dipropylene glycol dimethyl ether, dimethyl formamide, diethylene glycol methyl ether, ethylene glycol butyl ether, diethylene glycol butyl ether, butylglycidyl ether, propylene carbonate, D-limonene, a C 2 -C 40 fatty acid C 1 -C 10 alkyl ester, tetrahydrofurfuryl methacrylate, tetrahydrofurfuryl acrylate, 2-butoxy ethanol, butyl acetate, butyl lactate, furfuryl acetate, dimethyl sulfoxide, dimethyl formamide, a petroleum distillation product of fraction mineral oil, a hydrocarbon oil, a hydrocarbon including an aromatic carbon-carbon bond, a hydrocarbon including an alpha olefin, xylenes, an ionic liquid, methyl ethyl ketone, an ester of oxalic, maleic or succinic acid, methanol, ethanol, propanol, butyl alcohol, an aliphatic hydrocarbon, or a combination thereof.

10. The curable composition of claim 1 , wherein an epoxy silane resin reaction product of the curable composition comprises reduced or eliminated segregation of epoxy and silane domains, increasing homogeneity and temperature stability of the epoxy silane resin reaction product.

11. The curable composition of claim 1 , wherein an epoxy silane resin reaction product of the curable composition comprises a degradation onset between about 300° F. and about 800° F.

12. The curable composition of claim 1 , wherein an epoxy silane resin reaction product of the curable composition comprises a peak degradation temperature between about 550° F. and about 850° F.

13. The curable composition of claim 1 , wherein an epoxy silane resin reaction product of the curable composition comprises a ratio of epoxy functional groups to silane functional groups less than about 1 to 1000.

14. The curable composition of claim 1 , further comprising filler particles comprising aluminum oxide, awaruite, barium carbonate, barium oxide, barite, calcium carbonate, calcium oxide, cenospheres, chromite, chromium oxide, copper, copper oxide, dolomite, galena, hematite, hollow glass microspheres, ilmenite, iron oxide, siderite, magnetite, magnesium oxide, manganese carbonate, manganese dioxide, manganese (IV) oxide, manganese oxide, manganese tetraoxide, manganese (II) oxide, manganese (III) oxide, molybdenum (IV) oxide, molybdenum oxide, molybdenum trioxide, Portland cement, pumice, pyrite, spherelite, silica, silver, tenorite, titania, titanium (II) oxide, titanium (III) oxide, titanium (IV) dioxide, zirconium oxide, zirconium silicate, zinc oxide, cement-kiln dust, unexpanded and expanded perlite, attapulgite, bentonite, zeolite, elastomers, sand, micronized polymers, waxes, polymer fibers, inorganic fibers, and a combination thereof.

15. The curable composition of claim 1 , further comprising a silane coupling agent comprising a (C 1 -C 30 )hydrocarbyl-substituted trimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, n-beta-(aminoethyl)-gamma-aminopropyltrimethoxysilane, or a combination thereof.

16. The curable composition of claim 1 , further comprising a breaker to at least partially break a fluid surrounding the curable composition.

17. The curable composition of claim 1 , further comprising a viscosifier to increase a viscosity of the curable composition.

18. The curable composition of claim 1 , further comprising a proppant, an epoxy silane resin-coated proppant, resin-coated proppant, an encapsulated epoxy silane resin, or a combination thereof.