High-current ion implanter and method for controlling ion beam using high-current ion implanter
Provided herein are approaches for increasing operational range of an electrostatic lens. An electrostatic lens of an ion implantation system may receive an ion beam from an ion source, the electrostatic lens including a first plurality of conductive beam optics disposed along one side of an ion beam line and a second plurality of conductive beam optics disposed along a second side of the ion beam line. The ion implantation system may further include a power supply in communication with the electrostatic lens, the power supply operable to supply a voltage and a current to at least one of the first and second plurality of conductive beam optics, wherein the voltage and the current deflects the ion beam at a beam deflection angle, and wherein the ion beam is accelerated and then decelerated within the electrostatic lens.
1. An ion implantation system, comprising:
an electrostatic lens receiving an ion beam, the electrostatic lens including a first plurality of conductive beam optics disposed along one side of an ion beam line and a second plurality of conductive beam optics disposed along a second side of the ion beam line; and
a power supply in communication with the electrostatic lens, the power supply operable to supply a voltage and a current to at least one of the first and second plurality of conductive beam optics, wherein the voltage and the current deflects the ion beam at a beam deflection angle, and wherein the ion beam is accelerated and then decelerated within the electrostatic lens by modifying a voltage potential of the ion beam from a positive voltage potential at an entrance of the electrostatic lens, to a negative voltage potential within the electrostatic lens, and then to zero potential at an exit of the electrostatic lens.
2. The ion implantation system of claim 1 , further comprising a plasma flood gun positioned between the electrostatic lens and a wafer, wherein the plasma flood gun and the wafer are oriented at an angle relative to the ion beam line.
3. The ion implantation system of claim 2 , wherein the wafer is grounded, and wherein a mass analyzer and a collimator along the ion beam line are at the positive voltage potential.
4. The ion implantation system of claim 3 , wherein the positive voltage potential is greater than or equal to a potential of the first and second plurality of conductive beam optics.
5. The ion implantation system of claim 1 , wherein the positive voltage potential is greater than a potential of a chamber wall surrounding the first and second plurality of conductive beam optics.
6. The ion implantation system of claim 1 , wherein the ion beam enters the electrostatic lens at a beam potential greater than 0 kV.
7. The ion implantation system of claim 1 , wherein the first plurality of conductive beam optics is grounded.
8. The ion implantation system of claim 7 , wherein the voltage and the current are delivered only to the second plurality of conductive beam optics.
9. The ion implantation system of claim 1 , wherein the first and second plurality of conductive beam optics are devoid of any suppression electrodes.
10. The ion implantation system of claim 1 , wherein the first plurality of conductive beam optics is arranged in an asymmetric configuration relative to the second plurality of conductive beam optics.
11. The ion implantation system of claim 1 , further comprising:
an entrance tunnel, the entrance tunnel having an entrance axis extending into a chamber defined by a chamber wall; and
an exit tunnel, connected to the chamber and defining an exit axis, wherein the entrance axis and the exit axis define the beam deflection angle, the beam deflection angle being at least 30 degrees therebetween.
12. A lens, comprising:
a chamber wall defining a chamber; and
a first plurality of electrodes and a second plurality of electrodes within the chamber, the chamber receiving an ion beam from an ion source, wherein the first plurality of electrodes is disposed along one side of an ion beam line, wherein the second plurality of electrodes is disposed along a second side of the ion beam line, wherein a voltage and a current is supplied to at least one of the first and second plurality of electrodes to deflect the ion beam at a beam deflection angle, and wherein the ion beam is accelerated and then decelerated as the ion beam passes through the chamber by modifying a voltage potential of the ion beam from a positive voltage potential at an entrance of the chamber, to a negative voltage potential within the chamber, and then to zero potential at an exit of the chamber.
13. The lens of claim 12 , wherein the ion beam is delivered to a wafer, wherein the wafer is grounded, wherein a mass analyzer and a collimator along the ion beam line are at the positive potential, and wherein the positive potential is greater than or equal to a potential of the first and second plurality of electrodes.
14. The lens of claim 12 , wherein the positive voltage potential is greater than a potential of the chamber wall.
15. The lens of claim 12 , wherein the ion beam enters the chamber at a beam potential between 20 kV and 85 kV.
16. The lens of claim 12 , wherein the first plurality of electrodes is grounded.
17. The lens of claim 16 , wherein the voltage and the current are delivered only to the second plurality of electrodes.
18. The lens of claim 12 , wherein the first and second plurality of electrodes are devoid of any suppression electrodes, and wherein the first plurality of electrodes is arranged in an asymmetric configuration relative to the second plurality of electrodes.
19. The lens of claim 12 , further comprising:
an entrance tunnel, the entrance tunnel having an entrance axis extending into the chamber, wherein the chamber is defined by a chamber wall; and
an exit tunnel, connected to the chamber and defining an exit axis, wherein the entrance axis and the exit axis define the beam deflection angle, the beam deflection angle being at least 30 degrees therebetween.
20. An ion implantation system, comprising:
an electrostatic lens receiving an ion beam, the electrostatic lens including a first plurality of conductive beam optics disposed along one side of an ion beam line and a second plurality of conductive beam optics disposed along a second side of the ion beam line; and
a power supply in communication with the electrostatic lens, the power supply operable to supply a voltage and a current to at least one of the first and second plurality of conductive beam optics, wherein the voltage and the current deflects the ion beam at a beam deflection angle, and wherein the voltage and the current to the at least one of the first and second plurality of conductive beam optics causes the ion beam to accelerate and then decelerate within the electrostatic lens by modifying a voltage potential of the ion beam from a positive voltage potential at an entrance of the electrostatic lens, to a negative voltage potential within the electrostatic lens, and then to zero potential at an exit of the electrostatic lens.