Thermal Insulation Fastening System
A device for producing a component using an additive process is disclosed. In an embodiment a device includes an element for producing a component and an assembly for at least partially receiving the element, wherein the component is additively built up on the element, and/or wherein the assembly comprises a putty for thermal insulation and/or fastening of the element.
1 . A device for producing a component using an additive process, the device comprising:
an element for producing the component; and
an assembly for at least partially receiving the element,
wherein
the component is additively built up on the element, and/or
wherein the assembly comprises a putty for thermal insulation and/or fastening of the element.
2 . The device according to claim 1 , wherein the element is embedded by the putty and therefore mechanically fastened.
3 . The device according to claim 1 , wherein the putty has a coefficient of thermal expansion which is equal to or higher than that of the element.
4 . The device according to claim 1 , wherein a coefficient of thermal expansion of the putty is lower than a coefficient of thermal expansion of the element , and/or wherein a coefficient of thermal expansion of the component is different than a coefficient of thermal expansion of the element.
5 . The device according to claim 1 , wherein material properties of the component are inhomogeneous, and/or wherein the putty is a composite of a ceramic component and a non-ceramic component.
6 . The device according to claim 1 , wherein the additive process comprises selective laser melting (SLM) or selective laser sintering (SLS).
7 . The device according to claim 1 , wherein the device is located within a work space of the additive process, and wherein the component is produced within the work space.
8 . The device according to claim 1 , wherein the putty comprises a thermal insulation configured to preserve unprocessed powder from heat during the additive process.
9 . The device according to claim 1 , wherein the element is treated with a mixture of various heat conducting and anticorrosive additives, and/or wherein the putty is coated with a surface sealing material prior to starting the additive process.
10 . The device according to claim 1 , wherein a heat conducting foil/material/tub enables a fastening and/or positioning of the element , and/or wherein a foil is disposed between the element and the component so that the component and the element are separated.