Circuit board structure and manufacturing method thereof
A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.
1. A circular board structure, comprising:
a circuit layer structure comprising:
a plurality of dielectric layers;
circuits in the dielectric layers;
an insulating layer over the plurality of dielectric layers; and
a via in the insulating layer;
an electronic component disposed in the circuit layer structure, wherein the electronic component comprises a chip and a conductive bump, the chip has a first surface and a second surface that are oppositely disposed, the first surface of the chip contacts one of the dielectric layers, the conductive bump is located on the second surface of the chip and electrically connected to the chip, the insulating layer is over the second surface of the chip, and via is electronically connected to the conductive bump;
a stopper within the circuit layer structure, wherein the stopper is disposed over the second surface of the chip and abutting against the conductive bump; and
an adhesive layer located between the second surface of the chip and the insulating layer, the adhesive layer adheres to the conductive bump, and a thickness of the adhesive layer is greater than a thickness of the stopper.
2. The circuit board structure of claim 1 , wherein the stopper has a first portion and a second portion perpendicular to the first portion.
3. The circuit board structure of claim 1 , wherein the stopper abuts against the conductive bump in a first direction and a second direction perpendicular to the first direction.
4. The circuit board structure of claim 1 , wherein the conductive bump is located at a corner of a rectangular shape of the chip.
5. The circuit board structure of claim 1 , wherein a thickness of the conductive bump is greater than a thickness of the stopper.