IP Library Granted Patent US 11,509,352
Granted Patent B2
US 11,509,352 · App. 16/548,615 · Granted Nov 22, 2022

High frequency based beamforming antenna and communication method therefor

Inventors: Young Kyun Cho (Daejeon, KR); Jung Nam Lee (Daejeon, KR)
Assignee: Electronics and Telecommunications Research Institute
H04B3/52H01L23/66H01P3/16H01Q1/38H01Q3/36H01Q21/0037H01Q21/065H04B7/0617
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Quick Facts
Patent No.
US 11,509,352
App. No.
16/548,615
Granted
Nov 22, 2022
Kind
B2
Abstract

A method for transmitting signals using a high frequency based integrated circuit beamforming antenna is disclosed. The method may comprise transferring an output signal of a radio frequency (RF) module to an RF transceiving unit; transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and transferring a wave signal from the signal converting unit to a traveling wave antenna unit, and the feeding pillar may convert the output signal of the RF transceiving unit to the wave signal.

Claims (31)

1. A method for transmitting signals using a high frequency based integrated circuit beamforming antenna, the method comprising:

transferring an output signal of a radio frequency (RF) module to an RF transceiving unit;

transferring an output signal of the RF transceiving unit to a signal converting unit including a feeding pillar; and

transferring a wave signal from the signal converting unit to a traveling wave antenna unit,

wherein the feeding pillar converts the output signal of the RF transceiving unit to the wave signal,

wherein the travelling wave antenna unit includes at least one of a semiconductor substrate, an upper waveguide metal, and a lower waveguide metal, and

wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

2. The method according to claim 1 , wherein the RF transceiving unit includes at least one of an input/output signal line and a ground (GND) part.

3. The method according to claim 1 , wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

4. The method according to claim 1 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

5. A method for receiving signals using a high frequency based integrated circuit beamforming antenna, the method comprising:

transferring a signal received using a traveling wave antenna unit to a signal converting unit in form of a wave signal; and

transferring the wave signal to a radio frequency (RF) transceiving unit through a feeding pillar included in the signal converting unit,

wherein the feeding pillar converts the output signal of the RF transceiver to the wave signal,

wherein the travelling wave antenna unit includes at least one of a semiconductor substrate, an upper waveguide metal, and a lower waveguide metal, and

wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

6. The method according to claim 5 , further comprising transferring an RF signal output from the RF transceiving unit to an RF module.

7. The method according to claim 5 , wherein the RF transceiving unit includes at least one of an input/output signal line and a ground (GND) part.

8. The method according to claim 5 , wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

9. The method according to claim 5 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

10. A high frequency based integrated circuit beamforming antenna comprising:

a radio frequency (RF) transceiving unit including at least one of an input/output signal line and a ground (GND) part;

a signal converting unit including a feeding pillar; and

a travelling wave antenna unit including a semiconductor substrate,

wherein the feeding pillar converts the output signal of the RF transceiver to the wave signal,

wherein waveguide metal layers are deposited on both an upper surface and a lower surface of the semiconductor substrate, and

wherein the travelling wave antenna unit further includes at least one semiconductor reflector for steering an output beam.

11. The high frequency based integrated circuit beamforming antenna according to claim 10 , wherein the semiconductor substrate is directly connected to the feeding pillar of the signal converting unit or connected to the feeding pillar of the signal converting unit through at least one dielectric layer.

12. The high frequency based integrated circuit beamforming antenna according to claim 10 , wherein the at least one semiconductor reflector is a diode reflector.

13. The high frequency based integrated circuit beamforming antenna according to claim 10 , wherein a metal of a power source of the semiconductor reflector is different from a metal of the metal waveguide layers.

14. The high frequency based integrated circuit beamforming antenna according to claim 10 , wherein the travelling wave antenna unit further includes an antenna radiator for controlling an output gain of an output beam.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: CHO, YOUNG KYUN; LEE, JUNG NAM
To: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Reel/Frame 050140/0001 →
Priority Claims (1)
KR 10-2018-0147917 · Nov 27, 2018 · national
Continuity (1)
Related Publication 20200169291A1 · May 28, 2020
Cited By (1)
US 12,744,332