Electrical junction box and wire harness
An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.
1. An electrical junction box, comprising:
a conductive input busbar;
a conductive output busbar electrically connectable to the input busbar;
a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar;
a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay;
a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay; and
an insulating portion connected to each of the substrate, the input busbar, and the output busbar, wherein
the semiconductor relay is mounted on at least one of the input busbar and the output busbar, and
the input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate by the insulating portion.
2. The electrical junction box according to claim 1 , wherein
the insulating portion has a main body portion covering the semiconductor relay and a portion of each of the input busbar and the output busbar, and
the insulating portion has a leg portion provided so as to protrude from the main body portion toward the substrate, and the main body portion is separated away from the substrate by the leg portion.
3. The electrical junction box according to claim 2 , further comprising:
a casing housing therein the input busbar, the output busbar, the semiconductor relay, the substrate, the control terminal, and the insulating portion; and
a heatsink having a contact portion that contacts the insulating portion in the casing and an exposed portion that is formed integrally with the contact portion and exposed to outside of the casing, wherein
each of the input busbar, the output busbar, the semiconductor relay, and the insulating portion has a respective thermal conductivity and the thermal conductivity of the insulating portion is higher than the respective thermal conductivity of each of the input busbar, the output busbar, and the semiconductor relay.
4. The electrical junction box according to claim 2 , wherein
the insulating portion is molded.
5. The electrical junction box according to claim 3 , wherein
the insulating portion is molded.
6. A wire harness, comprising:
a power supply-side electric wire to be connected to a power supply side;
a load-side electric wire to be connected to a load side; and
an electrical junction box comprising: a conductive input busbar electrically connected to the power supply-side electric wire; a conductive output busbar electrically connectable to the input busbar and the load-side electric wire; a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar; a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay; a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay; and an insulating portion connected to each of the substrate, the input busbar, and the output busbar, wherein
the semiconductor relay is mounted on at least one of the input busbar and the output busbar, and
the input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate by the insulating portion.