IP Library › Granted Patent US 11,417,824
Granted Patent B2
US 11,417,824 · App. 16/556,277 · Granted Aug 16, 2022

Sensor module

Inventors: Yongfang Li (Kawasaki Kanagawa, JP); Takahiro Omori (Kawasaki Kanagawa, JP); Takashi Usui (Saitama Saitama, JP); Osamu Nishimura (Kawasaki Kanagawa, JP); Kazuo Watabe (Yokohama Kanagawa, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
H01L41/0472H03H9/02244H03H21/0007
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Quick Facts
Patent No.
US 11,417,824
App. No.
16/556,277
Granted
Aug 16, 2022
Kind
B2
Abstract

According to one embodiment, a sensor module includes at least one sensor and at least one switch. The sensor includes a first piezoelectric element. The first piezoelectric element includes a first electrode. The first piezoelectric element is set with a resonance frequency to resonate at a vibration frequency of a detection target. The switch includes a second piezoelectric element. The second piezoelectric element includes a second electrode connected to the first electrode and a third electrode electrically separated from the second electrode.

Claims (23)

1. A sensor module comprising:

at least one sensor comprising a first piezoelectric element, the first piezoelectric element including a first electrode and set with a resonance frequency to resonate at a vibration frequency of a detection target; and

at least one switch comprising a second piezoelectric element, the second piezoelectric element including a second electrode connected to the first electrode and a third electrode electrically separated from the second electrode,

wherein the switch is operated in accordance with bending of the second piezoelectric element, and the bending occurs when a voltage generated at the first electrode by resonance of the first piezoelectric element is applied to the second piezoelectric element via the second electrode.

2. The sensor module according to claim 1 , further comprising:

a fourth electrode facing the third electrode,

a data processing circuit configured to receive an output signal from the fourth electrode and extract a vibration frequency and strength applied to the sensor from the output signal, and

a wireless transmitter circuit configured to wirelessly transmit information of the vibration frequency and strength extracted by the data processing circuit.

3. The sensor module according to claim 1 , wherein the at least one sensor comprises a plurality of sensors comprising the respective first piezoelectric elements set with resonance frequencies to resonate at vibration frequencies of different detection targets, and

the at least one switch comprises a plurality of switches corresponding to the respective sensors.

4. The sensor module according to claim 1 , wherein the at least one sensor comprises a plurality of sensors forming a sensor array comprising the first piezoelectric elements configured to resonate at a same resonance frequency, and

the first electrodes of the plurality of sensors included in the sensor array are connected in series.

5. The sensor module according to claim 1 , wherein the at least one switch comprises a plurality of switches provided at a constant interval of the plurality of sensors included in the sensor array.

6. The sensor module according to claim 1 , wherein the first piezoelectric element or the second piezoelectric element is of a cantilever shape.

7. The sensor module according to claim 1 , wherein the first piezoelectric element or the second piezoelectric element is of a double supported beam shape.

8. The sensor module according to claim 1 , wherein: the first piezoelectric element is of a membrane shape, and

the first electrode is divided into a plurality of parts on the first piezoelectric element.

9. The sensor module according to claim 1 , wherein the plurality of parts of the first electrode are connected in series, and

the plurality of parts of the first electrode are connected to the second electrode at a constant interval.

10. The sensor module according to claim 1 , further comprising:

an electrostatic capacity switch facing the third electrode.

11. The sensor module according to claim 1 , further comprising:

a CMOS switch facing the third electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2019
From: LI, YONGFANG; OMORI, TAKAHIRO; USUI, TAKASHI; NISHIMURA, OSAMU; WATABE, KAZUO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 050634/0470 →
Priority Claims (1)
JP JP2019-048212 · Mar 15, 2019 · national
Continuity (1)
Related Publication 20200295250A1 · Sep 17, 2020