Sensor device and method of manufacture

1. A method of manufacturing a sensor device, the method comprising:

providing a package having a first die-receiving subframe defining a first volume separated by a partition wall of the package from a second die-receiving subframe defining a second volume;

disposing an elongate sensor element within the package, the elongate sensor element having a sensing region at a first end thereof and a second end distal from the first end, and the elongate sensor element extending from within the first volume so that the second end of the elongate sensor element extends into the partition wall, the elongate sensor element residing substantially in the first volume; and

dispensing an encapsulant material into the second volume after disposing the elongate sensor element within the package, the encapsulant material being impeded from progressing into the first volume.

2. The method according to claim 1 , further comprising:

disposing the elongate sensor element so as to bridge the first and second volumes, thereby extending through the partition wall so as to reside partially in the second volume.

3. The method according to claim 1 , further comprising:

providing an electrical contact at the second end of the elongate sensor element.

4. The method according to claim 3 , wherein

the second end of the elongate sensor element extends sufficiently into the second volume so that at least part of the electrical contact is accessible for connection within the second volume.

5. The method according to claim 1 , further comprising:

disposing a circuit in the second volume.

6. The method according to claim 5 , further comprising:

fixedly siting the circuit in the second volume by adhesion.

7. The method according to claim 5 , further comprising:

electrically coupling the circuit to the elongate sensor element.

8. The method according to claim 5 , further comprising:

providing wire bonding between the circuit and the elongate sensor element.

9. The method according to claim 5 , wherein the package comprises an internal lead contact terminal, and the circuit is a driver integrated circuit; and the method further comprises:

wire bonding the driver integrated circuit to the elongate sensor element and to the internal lead contact terminal of the package.

10. The method according to claim 1 , further comprising:

electrically connecting the elongate sensor element within the second volume.

11. The method according to claim 1 , wherein the second end of the elongate sensor element protrudes into the second volume; and the method further comprises:

enveloping the second end of the elongate sensor element with the encapsulant material.

12. The method according to claim 11 , further comprising:

forming a glob top with the encapsulant material.

13. The method according to claim 1 , further comprising:

providing the elongate sensor element so as to comprise a membrane located in the first volume.

14. The method according to claim 1 , further comprising:

providing the first and second volumes as first and second cavities, respectively.

15. The method according to claim 14 , further comprising:

providing the first and second cavities in stepped relation with respect to each other.

16. The method according to claim 14 , further comprising:

forming the first and second cavities so that the first cavity is deeper than the second cavity.

17. The method according to claim 1 , wherein the elongate sensor element comprises an upper surface and a lower surface; and the method further comprises:

providing the second volume as a cavity; and

configuring the first volume so that the upper and lower surfaces of the elongate sensor element are exposed to ambient.

18. The method according to claim 1 , further comprising:

forming the elongate sensor element as a pressure sensor.