Pulsing mixture of precursor and supercritical fluid to treat substrate surface
An injecting assembly includes a nozzle that is formed with a mixture channel, a mixture opening communicating with the mixture channel, a shaper channel, and a shaper opening communicating with the shaper channel. A mixture of a precursor and a supercritical fluid (SCF) passes through the mixture channel. Waves of the mixture are periodically injected toward a surface of a substrate at the mixture opening. A stream of a shaping fluid flows through the shaper channel and is injected toward the substrate at the shaper opening. The stream of the shaping fluid confines the waves of the mixture. Molecules of the precursor penetrate into the substrate by impact of the wave fronts reaching the surface of the substrate. The molecules of the precursor can react with molecules of a material of the substrate to improve surface properties of the substrate.
1. A process for treating a surface of a substrate, comprising:
passing a mixture of a precursor and a supercritical fluid (SCF) through a mixture channel of an injecting assembly;
periodically injecting waves of the mixture toward the substrate at a mixture opening of the injecting assembly that communicates with the mixture channel;
treating the surface of the substrate through penetration of molecules of the precursor into the substrate by impact of wave fronts reaching the surface of the substrate;
passing a shaping fluid through a shaper channel of the injecting assembly; and
injecting a stream of the shaping fluid toward the substrate at a shaper opening of the injecting assembly surrounding the mixture opening to confine the waves and increase a pressure of the waves on the substrate.
2. The process of claim 1 , wherein the waves propagate toward the substrate and generate shockwaves at the surface of the substrate.
3. The process of claim 2 , wherein the waves propagate toward the substrate with a velocity not lower than 100 meters per second.
4. The process of claim 1 , wherein the shaping fluid is the same material as the SCF in the mixture.
5. The process of claim 4 , wherein the waves propagate toward the substrate under a pressure higher than a critical pressure of the SCF.
6. The process of claim 1 , wherein a pressure of the mixture in the mixture channel is higher than a pressure of the shaping fluid in the shaper channel.
7. The process of claim 1 , wherein the injecting assembly is placed under atmosphere pressure.
8. The process of claim 1 , wherein the molecules of the precursor penetrate into the substrate up to a depth of 10 nm by the impact.
9. The process of claim 1 , wherein the molecules of the precursor cross link with molecules of a material in the substrate.
10. The process of claim 1 , further comprising:
injecting a reactant precursor toward the substrate, molecules of the reactant precursor reacting with the molecules of the precursor that penetrate into the substrate to transform the molecules of the precursor into a solid state.
11. The process of claim 1 , further comprising:
exposing the substrate to plasma radicals that react with the molecules of the precursor that penetrate into the substrate to transform the molecules of the precursor into a solid state.
12. The process of claim 1 , wherein the precursor is selected from a group consisting of: Trimethylaluminum, DMAON, Trisilylamine, PDMS (Polydimethylsiloxane), Silane coupling agents, Tetradimethylaminotitanium, Tetradimethylaminozirconium, Tetradimethylaminosilicon, silver sulfate, diol, thiol, amino, thio, and acids in carboxyl groups.
13. The process of claim 1 , wherein the SCF is selected from a group consisting of: carbon dioxide, Methane, Ethane, Propane, Ethylene, Propylene, Methanol, Ethanol, and Acetone.
14. A process for treating a surface of a substrate, comprising:
passing a mixture of a precursor and a supercritical fluid (SCF) through a mixture channel of an injecting assembly;
periodically injecting waves of the mixture toward the substrate at a mixture opening of the injecting assembly that communicates with the mixture channel; and
treating the surface of the substrate through penetration of molecules of the precursor into the substrate by impact of wave fronts reaching the surface of the substrate; and
transforming the molecules of the precursor into a solid state either by injecting a reactant precursor toward the substrate, molecules of the reactant precursor reacting with the molecules of the precursor that penetrate into the substrate, or by exposing the substrate to plasma radicals that react with the molecules of the precursor that penetrate into the substrate.
15. The process of claim 14 , further comprising:
passing a shaping fluid through a shaper channel of the injecting assembly; and
injecting a stream of the shaping fluid toward the substrate at a shaper opening of the injecting assembly surrounding the mixture opening to confine the waves and increase a pressure of the waves on the substrate.
16. The process of claim 15 , wherein the waves propagate toward the substrate and generate shockwaves at the surface of the substrate.
17. The process of claim 15 , wherein the shaping fluid is the same material as the SCF in the mixture.
18. The process of claim 15 , wherein a pressure of the mixture in the mixture channel is higher than a pressure of the shaping fluid in the shaper channel.
19. The process of claim 14 , wherein the injecting assembly is placed under atmosphere pressure.
20. The process of claim 14 , wherein the molecules of the precursor penetrate into the substrate up to a depth of 10 nm by the impact.
21. The process of claim 14 , wherein the molecules of the precursor cross link with molecules of a material in the substrate.