Power distribution network for 3D logic and memory
A semiconductor device is provided. The semiconductor device includes a transistor stack having a plurality of transistor pairs that are stacked over a substrate. Each transistor pair of the plurality of transistor pairs includes a n-type transistor and a p-type transistor that are stacked over one another. The plurality of transistor pairs have a plurality of gate electrodes that are stacked over the substrate and electrically coupled to gate structures of the plurality of transistor pairs, and a plurality of source/drain (S/D) local interconnects that are stacked over the substrate and electrically coupled to source regions and drain regions of the plurality of transistor pairs. The semiconductor device further includes one or more conductive planes formed over the substrate. The one or more conductive planes are positioned adjacent to the transistor stack, span a height of the transistor stack and are electrically coupled to the transistor stack.
1. A semiconductor device, comprising:
a transistor stack having a plurality of transistor pairs that are stacked over a substrate, wherein each transistor pair of the plurality of transistor pairs includes a n-type transistor and a p-type transistor that are stacked over one another, the plurality of transistor pairs have a plurality of gate electrodes that are stacked over the substrate and electrically coupled to gate structures of the plurality of transistor pairs, and a plurality of source/drain (S/D) local interconnects that are stacked over the substrate and electrically coupled to source regions and drain regions of the plurality of transistor pairs; and
one or more conductive planes formed over the substrate, the one or more conductive planes being positioned adjacent to the transistor stack, spanning a height of the transistor stack and being electrically coupled to the transistor stack.
2. The device of claim 1 , further comprising:
a plurality of power rails that are positioned below the transistor stack, wherein each of the one or more conductive planes is positioned over and extends along a respective power rail of the plurality of power rails so as to form a continuous connection.
3. The device of claim 1 , further comprising:
a plurality of power rails that are positioned below the transistor stack, wherein each of the one or more conductive planes is positioned over and across two or more power rails of the plurality of power rails so as to form two or more connection points.
4. The device of claim 2 , wherein the one or more conductive planes comprise a continuous lateral structure to draw power from the plurality of power rails into the transistor stack.
5. The device of claim 2 , wherein the one or more conductive planes comprise a piecewise interrupted structure with one or more channels being arranged therein, the piecewise interrupted structure being configured to create a conductive path from the plurality of power rails into the transistor stack.
6. The device of claim 1 , further comprising:
a plurality of power rails, the plurality of power rails being positioned over the one or more conductive planes, each of the one or more conductive planes being positioned along a respective power rail of the plurality of power rails so as to form a continuous connection.
7. The device of claim 1 , wherein one or more of the plurality of S/D local interconnects are electrically coupled to the one or more conductive planes.
8. The device of claim 1 , further comprising:
a plurality of vertical contacts formed in a direction perpendicular to the substrate and electrically coupled to the plurality of S/D local interconnects, at least one of the plurality of vertical contacts being electrically coupled to an output signal.
9. The device of claim 1 , wherein the n-type transistor and the p-type transistor share a gate structure that is electrically coupled to one of the plurality of gate electrodes.
10. A method of forming a semiconductor device, comprising:
forming a transistor stack including a plurality of transistor pairs that are stacked over a substrate, wherein each transistor pair of the plurality of transistor pairs includes a n-type transistor and a p-type transistor that are stacked over one another, the plurality of transistor pairs have a plurality of gate electrodes that are stacked over the substrate and electrically coupled to gate structures of the plurality of transistor pairs, and a plurality of source/drain (S/D) local interconnects that are stacked over the substrate and electrically coupled to source regions and drain regions of the plurality of transistor pairs; and
forming one or more conductive planes over the substrate, the one or more conductive planes being positioned adjacent to the transistor stack, spanning a height of the transistor stack and being electrically coupled to the transistor stack.
11. The method of claim 10 , further comprising:
forming a plurality of power rails, the plurality of power rails being positioned below the transistor stack, each of the one or more conductive planes extending along a respective power rail of the plurality of power rails so as to form a continuous connection.
12. The method of claim 10 , further comprising:
forming a plurality of power rails, the plurality of power rails being positioned below the transistor stack, each of the one or more conductive planes being positioned over and across two or more power rails of the plurality of power rails so as to form two or more connection points.
13. The method of claim 10 , further comprising:
forming a plurality of power rails, the plurality of power rails being positioned over the one or more conductive planes, each of the plurality of power rails extending along a respective power rail of the plurality of power rails so as to form a continuous connection.
14. The method of claim 10 , wherein the one or more conductive planes comprises a continuous lateral structure to draw power from a plurality of power rails into the transistor stack.
15. The method of claim 10 , wherein the one or more conductive planes comprises a piecewise interrupted structure that leaves channels and draws power from a plurality of power rails into the transistor stack.
16. The method of claim 10 , wherein one or more of the plurality of S/D local interconnects are electrically coupled to the one or more conductive planes.
17. The method of claim 10 , further comprising:
forming a plurality of vertical contacts that are positioned in a direction perpendicular to the substrate and electrically coupled to the plurality of S/D local interconnects, at least one of the plurality of vertical contacts being electrically coupled to an output signal.
18. A semiconductor device, comprising:
a plurality of transistor pairs that are stacked over a substrate, each transistor pair of the plurality of transistor pairs including a n-type transistor and a p-type transistor that are stacked over one another;
a plurality of gate electrodes that are stacked over the substrate and electrically coupled to gate structures of the plurality of transistor pairs;
a plurality of source/drain (S/D) local interconnects that are stacked over the substrate and electrically coupled to source regions and drain regions of the plurality of transistor pairs;
one or more conductive planes formed over the substrate, the one or more conductive planes being positioned adjacent to the plurality of transistor pairs, spanning a height of the plurality of transistor pairs and being electrically coupled to the plurality of transistor pairs; and
a plurality of power rails that are positioned over the substrate and electrically coupled to the one or more conductive planes.
19. The device of claim 18 , wherein the plurality of power rails are positioned over the one or more conductive planes, each of the plurality of power rails extending along a respective power rail of the plurality of power rails so as to form a continuous connection.
20. The device of claim 18 , wherein the plurality of power rails are positioned below the one or more conductive planes, each of the one or more conductive planes either being positioned over and extending along a respective power rail of the plurality of power rails so as to form a continuous connection, or being positioned over and across two or more power rails of the plurality of power rails so as to form two or more connection points.