Die attach systems including a verification substrate

1. A die attach system comprising:

a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers;

an imaging system for determining an alignment of the plurality of die with the verification substrate by imaging each of the plurality of die with respective ones of the plurality of substrate reference markers in a single field-of-view;

a bond tool for contacting each of the plurality of die during a transfer from a die supply source to the verification substrate; and

a supply support for supporting the die supply source, the die supply source being positioned between the bond tool and the verification substrate.

2. The die attach system of claim 1 wherein the imaging system includes a camera.

3. The die attach system of claim 1 wherein the imaging system is configured to obtain image data, the image data being used determine a positional deviation between each of the plurality of die with the respective ones of the plurality of substrate reference markers using image data from the imaging system.

4. The die attach system of claim 3 wherein the positional deviation includes deviation components along the x-axis, along the y-axis, and about a theta axis.

5. The die attach system of claim 1 wherein each of the plurality of die along with respective ones of the plurality of substrate reference markers are imaged in a single field-of-view of a camera of the imaging system.

6. The die attach system of claim 1 wherein the verification substrate is an accuracy verification substrate, and the alignment determined using the imaging system is a placement accuracy of each of the plurality of die after placement on the verification substrate.

7. The die attach system of claim 1 wherein the verification substrate is a glass substrate.

8. The die attach system of claim 1 wherein the verification substrate is an accuracy verification substrate, and the alignment determined using the imaging system is a pre bond alignment determined prior to bonding of each of the plurality of die to a substrate, where each of the plurality of die is positioned above the verification substrate during the pre bond alignment determination.

9. The die attach system of claim 8 wherein each of the plurality of die is adhered to a film of a die supply source during the pre bond alignment determination.

10. The die attach system of claim 1 wherein the supply support is independently moveable relative to a machine structure.

11. The die attach system of claim 1 wherein the die supply source is moveably mounted on the supply support.

12. The die attach system of claim 1 further comprising a support structure for supporting the verification substrate.

13. The die attach system of claim 1 wherein the plurality of substrate reference markers includes (i) a global alignment reference marker and (ii) a local substrate reference marker.

14. The die attach system of claim 1 wherein the plurality of substrate reference markers includes (i) a plurality of global alignment reference markers and (ii) a plurality of local substrate reference markers.

15. The die attach system of claim 1 wherein the plurality of substrate reference markers includes (i) a global alignment reference marker and (ii) a plurality of local substrate reference markers, the plurality of local substrate reference markers including at least four local substrate reference markers, wherein the at least four local substrate reference markers are configured such that a single die can be placed between the at least four local substrate reference markers.

16. The die attach system of claim 1 wherein the single field of view includes a measurement axis.

17. The die attach system of claim 1 wherein the single field of view includes a plurality of measurement axes.

18. The die attach system of claim 1 wherein the die attach system is configured to determine a systematic error from an offset of a plurality of die bonded to the verification substrate.