IP Library Granted Patent US 11,430,929
Granted Patent B2
US 11,430,929 · App. 16/561,256 · Granted Aug 30, 2022

Light emitting device having a stacked structure

Inventors: Jong Min Jang (Ansan-si, KR); Chang Yeon Kim (Ansan-si, KR)
Assignee: Seoul Viosys Co., Ltd.
H01L33/62H01L27/15H01L33/24H01L33/50
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Quick Facts
Patent No.
US 11,430,929
App. No.
16/561,256
Granted
Aug 30, 2022
Kind
B2
Abstract

A light emitting device including a first light emitting part including a first n-type semiconductor layer, a first active layer, and a first p-type semiconductor layer, a second light emitting part disposed on a first surface of the first light emitting part, and including a second n-type semiconductor layer, a second active layer, and a second p-type semiconductor layer, the second n-type semiconductor layer having a first surface and a second surface opposing the first surface, a third light emitting part disposed on a first surface of the second light emitting part, and including a third n-type semiconductor layer, a third active layer, and a third p-type semiconductor layer, a first contact structure contacting the first surface of the second n-type semiconductor layer, and a second contact structure contacting the second surface of the second n-type semiconductor layer.

Claims (29)

1. A light emitting device comprising:

a first light emitting part including a first n-type semiconductor layer, a first active layer, and a first p-type semiconductor layer;

a second light emitting part disposed on a first surface of the first light emitting part, and including a second n-type semiconductor layer, a second active layer, and a second p-type semiconductor layer, the second n-type semiconductor layer having a first surface and a second surface opposing the first surface;

a third light emitting part disposed on a first surface of the second light emitting part, and including a third n-type semiconductor layer, a third active layer, and a third p-type semiconductor layer;

a first contact structure contacting the first surface of the second n-type semiconductor layer; and

a second contact structure contacting the second surface of the second n-type semiconductor layer, wherein:

the first contact structure extends into the first light emitting part to electrically contact the first n-type semiconductor layer; and

the second contact structure extends into the second light emitting part to electrically contact the third n-type semiconductor layer.

2. The light emitting device according to claim 1 , further comprising a third contact structure extending into the third light emitting part to electrically contact the third n-type semiconductor layer.

3. The light emitting device according to claim 2 , further comprising:

a common pad disposed at a first corner of the light emitting device, and electrically coupled with the first, second, and third n-type semiconductor layers;

a first pad disposed at a second corner of the light emitting device, and electrically coupled with the first p-type semiconductor layer;

a second pad disposed at a third corner of the light emitting device, and electrically coupled with the second p-type semiconductor layer; and

a third pad disposed at a fourth corner of the light emitting device, and electrically coupled with the third p-type semiconductor layer,

wherein the first, second, and third n-type semiconductor layers are electrically coupled with one another by the first to third contact structures.

4. The light emitting device according to claim 3 , wherein:

the second light emitting part has a mesa structure, such that a portion thereof in the second corner is removed; and

the third light emitting part has a mesa structure, such that portions thereof in the second and third corners are removed.

5. The light emitting device according to claim 1 , further comprising:

a first color filter surrounding an outer sidewall of the first contact structure, and extending onto the first p-type semiconductor layer;

a first adhesion layer surrounding an outer sidewall of the first color filter, and extending onto the first color filter;

a second color filter surrounding an outer sidewall of the second contact structure, and extending onto the second p-type semiconductor layer; and

a second adhesion layer surrounding an outer sidewall of the second color filter, and extending onto the second color filter.

6. The light emitting device according to claim 1 , further comprising a substrate disposed over a second surface of the first light emitting part opposing the first surface thereof.

7. The light emitting device according to claim 1 , further comprising:

a common pad disposed on the third light emitting part, and electrically coupling the first, second, and third n-type semiconductor layers;

a first pad disposed on the third light emitting part, and electrically coupled with the first p-type semiconductor layer;

a second pad disposed on the third light emitting part, and electrically coupled with the second p-type semiconductor layer; and

a third pad disposed on the third light emitting part, and electrically coupled with the third p-type semiconductor layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2019
From: JANG, JONG MIN; KIM, CHANG YEON
To: SEOUL VIOSYS CO., LTD.
Reel/Frame 050278/0215 →
Continuity (2)
Provisional Application 62731206 · Sep 14, 2018
Related Publication 20200091389A1 · Mar 19, 2020
Cited By (1)
US 12,696,597