Using thermalizing material in an enclosure for cooling quantum computing devices
Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.
1. A system, comprising:
a quantum computing device;
an enclosure having the quantum computing device disposed within the enclosure, wherein the enclosure is leak-tight; and
at least one thermalizing material disposed within the enclosure, wherein the at least one thermalizing material is adapted to thermally link a cryogenic device to the quantum computing device, and wherein the at least one thermalizing material comprises a liquid thermalizing material, and at least a portion of the quantum computing device is immersed in the liquid thermalizing material.
2. The system of claim 1 , wherein the enclosure is coupled to the cryogenic device.
3. The system of claim 2 , wherein the cryogenic device is a dilution refrigerator, and wherein the enclosure is coupled to a mixing chamber plate of the dilution refrigerator.
4. The system of claim 1 , wherein the enclosure is a part of the cryogenic device.
5. The system of claim 1 , wherein the liquid thermalizing material comprises superfluid helium.
6. The system of claim 1 , wherein the enclosure comprises an enclosure opening to facilitate providing the liquid thermalizing material therein.
7. The system of claim 6 , further comprising:
a one-piece hollow body defining a fluid path; and
a valve coupled to the one-piece hollow body, wherein the enclosure opening comprises the valve, and wherein the fluid path traverses multiple stages of the cryogenic device.
8. The system of claim 7 , wherein the valve facilitates blocking the enclosure opening to facilitate evacuating excess liquid thermalizing material from the one-piece hollow body.
9. The system of claim 1 , wherein the enclosure comprises a connection to interact with the quantum computing device.
10. The system of claim 9 , wherein the connection comprises a hermetic microwave feedthrough into the enclosure, coupled to the quantum computing device.
11. The system of claim 9 , wherein the connection comprises a direct current feedthrough into the enclosure, coupled to the quantum computing device.
12. The system of claim 1 , wherein the at least one thermalizing material further comprises a solid thermalizing material.
13. The system of claim 12 , wherein the solid thermalizing material is in contact with the quantum computing device.
14. A method, comprising:
forming an enclosure, wherein the enclosure is leak-tight;
disposing a quantum computing device within the enclosure; and
providing a thermalizing material into the enclosure with the quantum computing device, wherein the thermalizing material is adapted to thermally link a cryogenic device to the quantum computing device, the thermalizing material comprises a liquid thermalizing material, and at least a portion of the quantum computing device is immersed in the liquid thermalizing material.
15. The method of claim 14 , further comprising coupling the enclosure to the cryogenic device.
16. The method of claim 14 , further comprising:
coupling a one-piece hollow body defining a fluid path to a valve disposed in an opening in the enclosure, wherein the providing the thermalizing material into the enclosure comprises providing the thermalizing material into the enclosure by employing the one-piece hollow body and the valve in an open state.
17. The method of claim 16 , further comprising:
changing the valve to be in a closed state; and
evacuating excess thermalizing material from the one-piece hollow body.
18. The method of claim 17 , wherein the one-piece hollow body traverses multiple temperature stages of the cryogenic device, and wherein the evacuating the excess thermalizing material from the one-piece hollow body prevents a thermal short between two or more of the multiple temperature stages.
19. The method of claim 14 , further comprising, connecting a microwave source to the quantum computing device via a cryogenic connector into the enclosure.
20. The method of claim 14 , wherein the liquid thermalizing material comprises superfluid helium.