Semiconductor light emitting device and method for manufacturing the same
A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
1. A semiconductor light emitting device comprising:
a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion;
a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion;
at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead;
a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and
a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source,
wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface,
the reverse surfaces of the first thick portion and the second thick portion are exposed from the resin package,
the reverse surfaces of the thirst thin portion and the second thin portion are covered by the resin package,
the resin package is in contact with the obverse surfaces of the first thick portion and the second thick portion,
the resin package has at least one straight edge in plan view, and
the at least one straight edge of the resin package comprises an inner straight edge extending to cross the first thick portion in plan view.
2. The semiconductor light emitting device according to claim 1 , wherein the at least one straight edge of the resin package comprises an outer straight edge from which a part of the second lead protrudes outward in plan view.
3. The semiconductor light emitting device according to claim 1 , wherein the resin package overlaps with the first lead in plan view.
4. The semiconductor light emitting device according to claim 1 , wherein the resin package overlaps with the second thick portion of the second lead in plan view.
5. The semiconductor light emitting device according to claim 1 , wherein the resin package includes a side surface, and at least a part of the first thin portion is exposed from the side surface of the resin package.
6. The semiconductor light emitting device according to claim 1 , wherein the reverse surface of the first thick portion has a first linear edge and a second linear edge that extend in different directions and that are exposed from the resin package.
7. The semiconductor light emitting device according to claim 1 , wherein an entirety of the reverse surface of the first thick portion is surrounded by the resin package in rear view.
8. The semiconductor light emitting device according to claim 1 , wherein the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion are flush with each other.
9. The semiconductor light emitting device according to claim 1 , wherein the at least one semiconductor light source comprises a plurality of semiconductor chips arranged in a row perpendicular to the first direction.
10. The semiconductor light emitting device according to claim 1 , wherein the sealing resin comprises a flat light-emitting surface.
11. The semiconductor light emitting device according to claim 1 , further comprising a wire connecting said one of the at least one semiconductor light source to the second lead, wherein an end of the wire is bonded to the obverse surface of the second thick portion.
12. A semiconductor light emitting device, comprising:
a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion;
a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion;
at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead;
a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and
a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source,
wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface,
the reverse surfaces of the first thick portion and the second thick portion are exposed from the resin package,
the reverse surfaces of the thirst thin portion and the second thin portion are covered by the resin package,
the resin package is in contact with the obverse surfaces of the first thick portion and the second thick portion, and
a combination of the sealing resin and the resin package is in contact with an entirety of the obverse surface of the second thin portion.
13. The semiconductor light emitting device according to claim 12 , wherein the resin package is out of contact with a part of the obverse surface of the second thin portion.
14. The semiconductor light emitting device according to claim 12 , wherein the resin package is in contact with the obverse surface of the first thin portion.
15. The semiconductor light emitting device according to claim 12 , wherein the resin package overlaps with the first lead in plan view.
16. The semiconductor light emitting device according to claim 12 , wherein the resin package overlaps with the second thick portion of the second lead in plan view.
17. The semiconductor light emitting device according to claim 12 , wherein the resin package includes a side surface, and at least a part of the first thin portion is exposed from the side surface of the resin package.
18. The semiconductor light emitting device according to claim 12 , wherein the reverse surface of the first thick portion has a first linear edge and a second linear edge that extend in different directions and that are exposed from the resin package.
19. The semiconductor light emitting device according to claim 12 , wherein an entirety of the reverse surface of the first thick portion is surrounded by the resin package in rear view.
20. The semiconductor light emitting device according to claim 12 , wherein the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion are flush with each other.
21. The semiconductor light emitting device according to claim 12 , wherein the at least one semiconductor light source comprises a plurality of semiconductor chips arranged in a row perpendicular to the first direction.
22. The semiconductor light emitting device according to claim 12 , wherein the sealing resin comprises a flat light-emitting surface.
23. The semiconductor light emitting device according to claim 12 , further comprising a wire connecting said one of the at least one semiconductor light source to the second lead, wherein an end of the wire is bonded to the obverse surface of the second thick portion.
24. A semiconductor light emitting device, comprising:
a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion;
a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion;
at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead;
a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and
a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source,
wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface,
the reverse surfaces of the first thick portion and the second thick portion are exposed from the resin package,
the reverse surfaces of the thirst thin portion and the second thin portion are covered by the resin package,
the resin package is in contact with the obverse surfaces of the first thick portion and the second thick portion,
the obverse surface of the first lead has a non-rectangular shape, and
the obverse surface of the first lead comprises a generally straight edge formed with a plurality of recesses spaced apart from each other along an entire length of the generally straight edge.
25. The semiconductor light emitting device according to claim 1 , wherein the resin package is in contact with the obverse surface of the first thin portion.
26. The semiconductor light emitting device according to claim 24 , wherein the resin package is in contact with the obverse surface of the first thin portion.
27. The semiconductor light emitting device according to claim 24 , wherein the resin package overlaps with the first lead in plan view.
28. The semiconductor light emitting device according to claim 24 , wherein the resin package overlaps with the second thick portion of the second lead in plan view.
29. The semiconductor light emitting device according to claim 24 , wherein the resin package includes a side surface, and at least a part of the first thin portion is exposed from the side surface of the resin package.
30. The semiconductor light emitting device according to claim 24 , wherein the reverse surface of the first thick portion has a first linear edge and a second linear edge that extend in different directions and that are exposed from the resin package.
31. The semiconductor light emitting device according to claim 24 , wherein an entirety of the reverse surface of the first thick portion is surrounded by the resin package in rear view.
32. The semiconductor light emitting device according to claim 24 , wherein the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion are flush with each other.
33. The semiconductor light emitting device according to claim 24 , wherein the at least one semiconductor light source comprises a plurality of semiconductor chips arranged in a row perpendicular to the first direction.
34. The semiconductor light emitting device according to claim 24 , wherein the sealing resin comprises a flat light-emitting surface.
35. The semiconductor light emitting device according to claim 24 , further comprising a wire connecting said one of the at least one semiconductor light source to the second lead, wherein an end of the wire is bonded to the obverse surface of the second thick portion.
36. A semiconductor light emitting device, comprising:
a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion;
a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion;
at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead;
a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and
a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source,
wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface,
the reverse surfaces of the first thick portion and the second thick portion are exposed from the resin package,
the reverse surfaces of the thirst thin portion and the second thin portion are covered by the resin package,
the resin package is in contact with the obverse surfaces of the first thick portion and the second thick portion, and
wherein the resin package is out of contact with a part of the obverse surface of the second thin portion.
37. The semiconductor light emitting device according to claim 36 , wherein the obverse surface of the second thin portion comprises: an inner area exposed to the space defined by the inclined surface of the resin package; and a remaining area other than the inner area, wherein an entirety of the remaining area is in contact with the resin package.
38. The semiconductor light emitting device according to claim 36 , wherein the resin package is in contact with the obverse surface of the first thin portion.
39. The semiconductor light emitting device according to claim 36 , wherein the resin package overlaps with the first lead in plan view.
40. The semiconductor light emitting device according to claim 36 , wherein the resin package overlaps with the second thick portion of the second lead in plan view.
41. The semiconductor light emitting device according to claim 36 , wherein the resin package includes a side surface, and at least a part of the first thin portion is exposed from the side surface of the resin package.
42. The semiconductor light emitting device according to claim 36 , wherein the reverse surface of the first thick portion has a first linear edge and a second linear edge that extend in different directions and that are exposed from the resin package.
43. The semiconductor light emitting device according to claim 36 , wherein an entirety of the reverse surface of the first thick portion is surrounded by the resin package in rear view.
44. The semiconductor light emitting device according to claim 36 , wherein the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion are flush with each other.
45. The semiconductor light emitting device according to claim 36 , wherein the at least one semiconductor light source comprises a plurality of semiconductor chips arranged in a row perpendicular to the first direction.
46. The semiconductor light emitting device according to claim 36 , wherein the sealing resin comprises a flat light-emitting surface.
47. The semiconductor light emitting device according to claim 36 , further comprising a wire connecting said one of the at least one semiconductor light source to the second lead, wherein an end of the wire is bonded to the obverse surface of the second thick portion.