IP Library Granted Patent US 11,087,853
Granted Patent B2
US 11,087,853 · App. 16/565,518 · Granted Aug 10, 2021

Power-on over-erasure correction method and memory device utilizing same

Inventor: Chih-Hao Chen (New Taipei, TW)
Assignee: ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC.
G11C16/3404G11C16/26G11C16/30G11C16/344
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Quick Facts
Patent No.
US 11,087,853
App. No.
16/565,518
Granted
Aug 10, 2021
Kind
B2
Abstract

A memory device includes a plurality of memory blocks and each memory block includes a plurality of columns of memory cells. Each column of memory cells is coupled to a corresponding bit line. Upon completion of a power-up sequence, detect if a current leakage of corresponding columns in a group of memory blocks is greater than a predetermined level. If the current leakage of the corresponding columns in the group of memory blocks is greater than the predetermined level, perform an over-erasure correction on the corresponding columns.

Claims (36)

1. An over-erasure correction method for use in a memory device, the memory device comprising a plurality of memory blocks, each memory block comprising a plurality of columns of memory cells, each column of memory cells being coupled to a corresponding bit line, and the over-erasure correction method comprising:

upon completion of a power-up sequence, detecting if a current leakage of corresponding columns in a group of the memory blocks is greater than a predetermined level; and

if the current leakage of the corresponding columns in the group of the memory blocks is greater than the predetermined level, performing an over-erasure correction on the corresponding columns.

2. The over-erasure correction method of claim 1 , wherein detecting if the current leakage of the corresponding columns in the group of the memory blocks is greater than the predetermined level comprises:

simultaneously selecting bit lines coupled to the corresponding columns to detect the current leakage.

3. The over-erasure correction method of claim 1 , wherein the group of the memory blocks comprises two or more memory blocks.

4. The over-erasure correction method of claim 1 , wherein performing the over-erasure correction on the corresponding columns comprises:

applying at least one over-erasure correction pulse to the corresponding columns.

5. An over-erasure correction method for use in a memory device, the memory device comprising a plurality of memory blocks, each memory block comprising a plurality of columns of memory cells, each column of memory cells being coupled to a corresponding bit line, and the over-erasure correction method comprising:

upon completion of a power-up sequence, detecting if a current leakage of corresponding columns in a group of the memory blocks is greater than a predetermined level;

if the current leakage of the corresponding columns in the group of the memory blocks is greater than the predetermined level, determining which memory block of the group of the memory blocks is a leaky memory block; and

performing an over-erasure correction on a corresponding column of the leaky memory block.

6. The over-erasure correction method of claim 5 , wherein determining which memory block of the group of the memory blocks is the leaky memory block comprises:

selecting a bit line coupled to a corresponding column of a memory block of the group of the memory blocks while deselecting bit lines coupled to corresponding columns of remaining memory blocks of the group of the memory blocks to detect if the memory block is the leaky memory block.

7. The over-erasure correction method of claim 5 , further comprising:

determining if a column of the leaky memory block following the corresponding column of the leaky memory block has another current leakage.

8. The over-erasure correction method of claim 7 , further comprising:

performing an over-erasure correction on the column of the leaky memory block following the corresponding column of the leaky memory block if the column of the leaky memory block following the corresponding column of the leaky memory block has the another current leakage.

9. The over-erasure correction method of claim 5 wherein performing the over-erasure correction on the corresponding column of the leaky memory block comprises:

applying at least one over-erasure correction pulse to the corresponding column of the leaky memory block until another current leakage of the corresponding column of the leaky memory block is less than the predetermined level.

10. A memory device comprising:

a plurality of bit lines;

a group of memory blocks coupled to the plurality of bit lines, each memory block comprising a plurality of columns of memory cells and block selecting switches respectively coupled to the plurality of columns of memory cells, each column of memory cells being coupled to a corresponding bit line; and

a controller coupled to the group of the memory blocks, and configured to select, upon completion of a power-up sequence, the block selecting switches to detect if a current leakage of corresponding columns in the group of the memory blocks is greater than a predetermined level;

wherein the controller is further configured to apply an over-erasure correction to the corresponding columns if the current leakage of the corresponding columns in the group of the memory blocks is greater than the predetermined level.

11. The memory device of claim 10 , further comprising a sensing circuit coupled to the controller, wherein the controller is further configured to simultaneously select bit lines coupled to the corresponding columns for the sensing circuit to detect the current leakage.

12. The memory device of claim 10 , wherein the memory device is a NOR-type flash memory.

13. A memory device comprising:

a plurality of bit lines;

a group of memory blocks coupled to the plurality of bit lines, each memory block comprising a plurality of columns of memory cells and block selecting switches respectively coupled to the plurality of columns of memory cells, each column of memory cells being coupled to a corresponding bit line; and

a controller coupled to the group of memory blocks, and configured to select, upon completion of a power-up sequence, the block selecting switches to detect if a current leakage of corresponding columns in a group of memory blocks is greater than a predetermined level;

wherein if the current leakage of the corresponding columns in the group of the memory blocks is greater than the predetermined level, the controller is further configured to determine which memory block of the group of the memory blocks is a leaky memory block, and perform a first over-erasure correction on a corresponding column of the leaky memory block.

14. The memory device of claim 13 , wherein the controller is configured to select a bit line coupled to a corresponding column of a memory block of the group of the memory blocks while deselecting bit lines coupled to corresponding columns of remaining memory blocks of the group of the memory blocks to detect if the memory block is the leaky memory block.

15. The memory device of claim 13 , wherein the controller is further configured to determine if a column of the leaky memory block following the corresponding column of the leaky memory block has another current leakage.

16. The memory device of claim 15 , wherein the controller is further configured to perform a second over-erasure correction on the column of the leaky memory block following the corresponding column of the leaky memory block if the column of the leaky memory block following the corresponding column of the leaky memory block has the another current leakage.

17. The memory device of claim 13 , wherein the controller is configured to apply at least one over-erasure correction pulse to the corresponding column of the leaky memory block until another current leakage of the corresponding column is less than the predetermined level.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2025
From: ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC.
To: ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.
Reel/Frame 071703/0241 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2019
From: CHEN, CHIH-HAO
To: ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC.
Reel/Frame 050320/0602 →
Continuity (1)
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