Dual-band antenna, device and method for manufacturing
A dual-band antenna or coupled resonators, related wireless device applications, and methods of manufacturing the same are provided. Embodiments of the antenna have resonant frequencies in a lower 2-3 GHz frequency band and a higher 5-6 GHz frequency band range. The antenna has a high frequency portion that may be configured to operate as an inverted F antenna. The high frequency element is also positioned adjacent to a nearby parasitic element. In operation, the high frequency element and the parasitic element couple together and form a current loop, or loop antenna which is configured to resonate at a low frequency band.
1. A dual-band antenna comprising:
a ground plane functioning as a heat sink;
a molded parasitic element electrically connected to the ground plane, the parasitic element being part of the heat sink, wherein a first width of the parasitic element is larger at a first end relative to a second width of the parasitic element at a second end; and
a high frequency element for resonating at a high frequency band and connected to the ground plane via a short, the high frequency element configured as an inverted F antenna,
wherein the high frequency element is capacitively coupled to the parasitic element forming a loop antenna that resonates at a low frequency band;
wherein the high frequency band is in 5-6 GHz range, and the low frequency band is in 2-3 GHz range.
2. The dual-band antenna of claim 1 , wherein the inverted F antenna has a portion such that a width of the portion is greater than ¼ of a length of the portion.
3. The dual-band antenna of claim 1 , wherein the parasitic element is formed from one of a shield can, part of the heat sink, an enclosure, and a stamped metallic sheet.
4. The dual-band antenna of claim 1 , in which the loop antenna comprises a mechanical connection to the ground plane.
5. The dual-band antenna of claim 1 , in which the parasitic element is manufactured as a separate component.
6. A wireless device having a housing, the wireless device comprising:
a heat sink; and
at least one dual-band antenna comprising:
a high frequency element that resonates in a high frequency band, the high frequency element configured as an inverted F antenna; and
a molded parasitic element capacitively coupled to the high frequency element forming a current loop, the parasitic element being part of the heat sink, wherein a first width of the parasitic element is larger at a first end relative to a second width of the parasitic element at a second end;
wherein the current loop resonates at a low frequency band;
wherein the high frequency band is in 5-6 GHz range, and the low frequency band is in 2-3 GHz range.
7. The wireless device of claim 6 , further comprising at least one device component that is one of a fan module and a printed circuit board.
8. The wireless device of claim 6 , wherein a portion of the inverted F antenna has a width that is greater than ¼ of a length of the portion.
9. A method for manufacturing a wireless device, the method comprising:
providing a heat sink disposed within a housing of the wireless device, and
providing at least one antenna element disposed within the housing, the at least one antenna element having a molded parasitic element and a high frequency element, the parasitic element being part of the heat sink, wherein a first width of the parasitic element is larger at a first end relative to a second width of the parasitic element at a second end,
wherein the high frequency element is an inverted F antenna that resonates at a high frequency band, and the high frequency element is capacitively coupled to the parasitic element forming a current loop that resonates at a low frequency band;
wherein the high frequency band is in 5-6 GHz range, and the low frequency band is in 2-3 GHz range.
10. The method of claim 9 , wherein the step of providing the at least one antenna element comprises manufacturing the parasitic element as a separate component.