Semiconductor memory device
A semiconductor memory device includes n interconnect layers above a substrate; and a first interconnect region between an end of a control circuit and an end of the substrate in a direction of a first axis beside a first pad region in a direction of a second axis. The n interconnect layers are located at different levels from the substrate. Each of the n interconnect layers includes an interconnect. The first interconnect region includes no transistor, and no contact coupled to the substrate. The first interconnect region includes an interconnect extending along the second axis in m (m is a natural number equal to or larger than 3, larger than n/2, and equal to or smaller than n) interconnect layers of the n interconnect layers.
1. A semiconductor memory device, comprising:
a memory cell array that includes a first select transistor, a memory cell, and a second select transistor;
a bit line that is connected to the first select transistor;
a sense amplifier that senses voltages of the bit line;
a first pad region that includes a first pad;
a second pad region that includes a second pad;
a control circuit that is located between the first pad region and the second pad region and includes a first end and a second end that are opposed to each other;
a first interconnect region that includes a first interconnect that includes a first section extended to a first direction and a second section extended to a second direction perpendicular to the first direction, the first section and the second section are coupled to each other; and
a second interconnect region that includes a second interconnect that includes a third section extended to the first direction and a fourth section extended to the second direction, the third section and the fourth section are coupled to each other, wherein:
the first section is connected to the first end, the second section is connected to the first pad region, the third section is connected to the second end, and the fourth section is connected to the second pad.
2. The device according to claim 1 , further comprising a third interconnect region between the first pad region and the second pad region, the third interconnect region including a third interconnect that includes a fifth section.
3. The device according to claim 2 , wherein:
the third interconnect region is located between an end of the control circuit and an end of the semiconductor device.
4. The device according to claim 2 , wherein:
the fifth section is extended from an extension line of the first end of the control circuit to an extension line of the second end of the control circuit.
5. The device according to claim 2 , wherein:
the first pad region, the second pad region, and the third interconnect region are located on an end of the semiconductor memory device.
6. The device according to claim 2 , wherein:
the third interconnect region includes no transistor and includes no contact coupled to a substrate.
7. The device according to claim 1 , wherein:
the control circuit comprises a contact coupled to a substrate.
8. The device according to claim 1 , wherein:
the first interconnect region includes no transistor and includes no contact coupled to a substrate, and
the second interconnect region includes no transistor and includes no contact coupled to the substrate.