IP Library › Granted Patent US 11,614,350
Granted Patent B2
US 11,614,350 · App. 16/575,732 · Granted Mar 28, 2023

Sensor test apparatus

Inventors: Kazunari Suga (Tokyo, JP); Daisuke Takano (Tokyo, JP); Satoshi Hanamura (Tokyo, JP); Michiro Chiba (Tokyo, JP); Hisao Nishizaki (Tokyo, JP); Atsushi Hayakawa (Tokyo, JP)
Assignee: ADVANTEST Corporation
G01D18/00G01L25/00G01R31/2867G01R31/2874G01R31/2881G01R35/00G01D2218/10G01R1/0441G01R31/2829
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Quick Facts
Patent No.
US 11,614,350
App. No.
16/575,732
Granted
Mar 28, 2023
Kind
B2
Abstract

A sensor test apparatus having excellent versatility is provided. The sensor test apparatus includes a first application unit 40 including a first application device including a socket to which the sensor is electrically connected, and a pressure chamber 43 which applies pressure to the sensor, a test unit which tests the sensor 90 via the socket, a conveying robot which conveys the sensor into and out of the first application unit 40 , and an apparatus main body which houses the first application unit 40 , the test unit 35 and the conveying robot, and the apparatus main body has an opening which allows the first application unit 40 to be inserted into the apparatus main body and removed from the apparatus main body to an outside.

Claims (67)

1. A sensor test apparatus which tests a sensor which detects a physical quantity, the sensor test apparatus comprising:

a first application unit comprising one or more application devices each including:

a socket to which the sensor is electrically connected; and

an application part which applies the physical quantity to the sensor, the physical quantity being detected by the sensor;

a test unit which tests the sensor via the socket;

a conveying device which conveys the sensor into and out of the first application unit;

an apparatus main body which houses the first application unit, the test unit and the conveying device; and

a unit connection part to which the first application unit is detachably connected and that is connectable to a second application unit, wherein

the apparatus main body has a first opening for inserting the first application unit into the apparatus main body and for removing the first application unit out of the apparatus main body.

2. The sensor test apparatus according to claim 1 , further comprising:

a pressure adjustment unit that supplies a compressed air, wherein

the application part is a pressure application part that comprises a pressure chamber to which the compressed air is supplied by the pressure adjustment unit and that applies a pressure to the sensor, and

the second application unit comprises a socket to which the sensor is electrically connected and a differential pressure application part which applies two kinds of pressure to the sensor.

3. The sensor test apparatus according to claim 2 , wherein

the unit connection part includes:

a first pipe connector to which the pressure application part of the first application unit is connected;

a second pipe connector to which the differential pressure application part of the second application unit is connected; and

a first electrical connector to which the socket of the first or second application unit is connected.

4. The sensor test apparatus according to claim 1 , further comprising:

a pressure adjustment unit that supplies a compressed air, wherein

the application part is a pressure application part that comprises a pressure chamber to which the compressed air is supplied by the pressure adjustment unit and that applies a pressure to the sensor, and

the second application unit includes a socket to which the sensor is electrically connected and a magnetic field application part which applies a magnetic field to the sensor.

5. The sensor test apparatus according to claim 4 , wherein

the unit connection part includes:

a first pipe connector to which the pressure application part of the first application unit is connected;

a first electrical connector to which the socket of the first or second application unit is connected; and

a second electrical connector to which the magnetic field application part of the second application unit is connected.

6. The sensor test apparatus according to claim 1 , wherein

the application part is a differential pressure application part which applies two kinds of pressure to the sensor, and

the second application unit includes a socket to which the sensor is electrically connected and a magnetic field application part which applies a magnetic field to the sensor.

7. The sensor test apparatus according to claim 6 , wherein

the unit connection part includes:

a second pipe connector to which the differential pressure application part of the first application unit is connected;

a first electrical connector to which the socket of the first or second application unit is connected; and

a second electrical connector to which the magnetic field application part of the second application unit is connected.

8. The sensor test apparatus according to claim 1 , wherein each of the one or more application devices further includes a temperature adjustment part which applies a thermal stress to the sensor to adjust the temperature of the sensor.

9. The sensor test apparatus according to claim 8 , wherein the unit connection part includes at least one of a third pipe connector and a third electrical connector to which the temperature adjustment part is connected.

10. The sensor test apparatus according to claim 1 , wherein

each of the one or more application devices further includes:

a temperature adjustment part which applies a thermal stress to the sensor to adjust the temperature of the sensor; and

a pusher which contacts the sensor and presses the sensor against the socket, and the temperature adjustment part is disposed in the pusher.

11. The sensor test apparatus according to claim 1 , wherein the first application unit comprises two or more of the application devices.

12. The sensor test apparatus according to claim 1 , wherein the first application unit is removed out of the apparatus main body through the first opening in a first direction.

13. The sensor test apparatus according to claim 12 , wherein

the apparatus main body has

a second opening for removing the conveying device out of the apparatus main body in a second direction opposite to the first direction,

a third opening through which the sensor is fed to a first position in the sensor test apparatus, and

a fourth opening through which the sensor is ejected from a second position in the sensor test apparatus, and

the conveying device moves an untested sensor from the first position to the first application unit and moves a tested sensor from the first application unit to the second position.

14. The sensor test apparatus according to claim 13 , wherein,

in plan view, the first position, the first application unit and the second position are arranged in a substantially U-shape around the conveying device,

the third opening is open in a third direction substantially orthogonal to the first direction and substantially orthogonal to the second direction, and

the fourth opening is open in a fourth direction opposite the third direction.

15. The sensor test apparatus according to claim 13 , further comprising:

a preheat part which is disposed between the first position and the first application unit and which applies a thermal stress to the sensor before being conveyed into the first application unit; and

a heat removal part which is disposed between the first application unit and the second position and which removes a thermal stress from the sensor after being conveyed out of the first application unit, wherein

the conveying device moves the untested sensor from the first position to the preheat part, moves the untested sensor from the preheat part to the first application unit, moves the tested sensor from the first application unit to the heat removal part, and moves the tested sensor from the heat removal part to the second position.

16. A sensor test apparatus which tests a sensor which detects a physical quantity, the sensor test apparatus comprising:

a first application unit comprising one or more application devices each including:

a socket to which the sensor is electrically connected; and

an application part which applies the physical quantity to the sensor;

a test unit which tests the sensor via the socket;

a conveying device which conveys the sensor into and out of the first application unit; and

an apparatus main body which houses the first application unit, the test unit and the conveying device, wherein

the apparatus main body has a first opening for inserting the first application unit into the apparatus main body and for removing the first application unit out of the apparatus main body,

the first application unit is removed out of the apparatus main body through the first opening in a first direction, and

the apparatus main body includes a slide mechanism which slidably holds the first application unit in the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2019
From: SUGA, KAZUNARI; TAKANO, DAISUKE; HANAMURA, SATOSHI; CHIBA, MICHIRO; NISHIZAKI, HISAO; HAYAKAWA, ATSUSHI
To: ADVANTEST CORPORATION
Reel/Frame 050789/0553 →
Priority Claims (1)
JP JP2018-234115 · Dec 14, 2018 · national
Continuity (1)
Related Publication 20200191622A1 · Jun 18, 2020