Cooling electronic devices in a data center
A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
1. A method comprising:
flowing a liquid phase of a working fluid from a condenser of a thermosiphon to an evaporator of the thermosiphon in a transport member of the thermosiphon;
flowing the liquid phase of the working fluid into a fluid channel of the evaporator from the transport member;
flowing the liquid phase of the working fluid from the fluid channel to a plurality of fluid pathways that extend through the fluid channel and are enclosed between the evaporator and the transport member;
boiling at least a portion of the liquid working fluid flowing in the plurality of fluid pathways based on a transfer of heat from at least one data center heat generating electronic device that is thermally coupled to the evaporator; and
flowing a mixed phase of the working fluid out of the plurality of fluid pathways into at least one vapor conduit of the transport member through an elongated aperture of the transport member at outlets of the plurality of fluid pathways and to the condenser.
2. The method of claim 1 , further comprising:
transferring heat from the heat-generating electronic devices to the working fluid through a heat transfer surface that forms the plurality of fluid pathways; and
changing the working fluid from the liquid phase to the mixed-phase between inlets of the fluid pathways and outlets of the fluid pathways.
3. The method of claim 2 , further comprising:
flowing the liquid phase into the inlets of the fluid pathways positioned at a first end of the fluid pathways; and
flowing the mixed phase out of the outlets of the fluid pathways positioned at a second end of the fluid pathways opposite the first end.
4. The method of claim 2 , further comprising flowing the working fluid through a plurality of fins or ridges positioned that form the plurality of fluid pathways in the fluid channel.
5. The method of claim 4 , wherein flowing the working fluid through the plurality of fins or ridges that form the plurality of fluid pathways in the fluid channel comprises flowing the working fluid transversely from the fluid channel through the plurality of fluid pathways.
6. The method of claim 5 , further comprising transferring heat from the working fluid in the at least one vapor conduit to the working fluid in a liquid conduit of the transfer member through a heat transfer interface between the liquid conduit and the vapor conduit in the transport member.
7. The method of claim 6 , wherein the liquid phase is at a saturation temperature of the working fluid.
8. The method of claim 7 , further comprising flowing the mixed phase of the working fluid through the at least one vapor conduit to the condenser.
9. The method of claim 3 , further comprising transferring heat from the working fluid in the vapor conduit to the working fluid in the liquid conduit of the transfer member through a heat transfer interface between the liquid conduit and the vapor conduit in the transport member.
10. The method of claim 1 , further comprising transferring heat from the working fluid in the vapor conduit to the working fluid in the liquid conduit through a heat transfer interface between the liquid conduit and the vapor conduit in the transport member.
11. The method of claim 1 , wherein the liquid phase is at a saturation temperature of the working fluid.
12. The method of claim 1 , further comprising flowing the mixed phase of the working fluid through the at least one vapor conduit to the condenser.
13. The method of claim 1 , wherein flowing the mixed phase of the working fluid out of the plurality of fluid pathways into the at least one vapor conduit of the transport member and to the condenser comprises flowing a mixed phase of the working fluid out of the plurality of fluid pathways into two separate vapor conduits of the transport member and to the condenser.
14. The method of claim 1 , further comprising:
flowing the mixed phase of the working fluid through the at least one vapor conduit that is positioned in an upper half of the transport member; and
flowing the liquid phase of the working fluid through a liquid conduit that is positioned in a lower half of the transport member.
15. The method of claim 1 , wherein the transport member comprises a condenser end that comprises an inlet of a liquid conduit that is offset in the transport member relative to an outlet of the vapor conduit in the condenser end of the transport member.
16. The method of claim 15 , wherein the transport member slopes from the condenser to the evaporator, and a magnitude of the slope defines, at least in part, a liquid head of the working fluid.
17. The method of claim 1 , wherein the transport member slopes from the condenser to the evaporator, and a magnitude of the slope defines, at least in part, a liquid head of the working fluid.
18. The method of claim 17 , wherein the liquid head of the working fluid is equal to a sum of a plurality of pressure losses in a closed loop fluid circuit that comprises a liquid conduit, the evaporator, the vapor conduit, and the condenser.
19. The method of claim 6 , wherein the liquid conduit extends through the transport member and comprises an elongated slot at the inlets of the plurality of fluid pathways, and flowing the liquid phase of the working fluid into a fluid channel comprises flowing the liquid phase of the working fluid into a portion of the fluid channel at the inlets of the plurality of fluid pathways.
20. The method of claim 19 , wherein the vapor conduit extends through the transport member and comprises a second elongated slot at the outlets of the plurality of fluid pathways, and flowing the mixed phase of the working fluid out of the plurality of fluid pathways comprises flowing the mixed phase of the working fluid into the second elongated slot.
21. The method of claim 20 , wherein the transport member further comprises a bottom surface to contact a top of the heat transfer surface and vertically enclose the plurality of fluid pathways at the top of the heat transfer surface, each of the plurality of fluid pathways comprising sidewalls defining a height and formed by adjacent fins or ridges and a bottom formed by a floor of the fluid channel, the inlets of the fluid pathways comprising apertures defined by a first vertical plane perpendicular to the floor of the fluid channel, and
the outlets of the fluid pathways comprise apertures defined by a second vertical plane perpendicular to the floor of the fluid channel, and
boiling the at least a portion of the working fluid comprises flowing the working fluid from the inlets, in a direction transverse to the height of the fins or ridges across at least a portion of the evaporator, to the outlets, the working fluid being vertically enclosed within the fluid pathways as the working fluid flows to the outlets of the fluid pathways.
22. A method comprising:
flowing a liquid phase of a working fluid from a condenser of a thermosiphon to an evaporator of the thermosiphon in a transport member of the thermosiphon;
flowing the liquid phase of the working fluid into a fluid channel of the evaporator from the transport member;
flowing the liquid phase of the working fluid from the fluid channel to a plurality of fluid pathways that extend through the fluid channel and are enclosed between the evaporator and the transport member;
flowing the working fluid through a plurality of fins or ridges positioned that form the plurality of fluid pathways in the fluid channel, where flowing the working fluid through the plurality of fins or ridges that form the plurality of fluid pathways in the fluid channel comprises flowing the working fluid transversely from the fluid channel through the plurality of fluid pathways;
transferring heat from the heat-generating electronic devices to the working fluid through a heat transfer surface that forms the plurality of fluid pathways;
boiling at least a portion of the liquid working fluid flowing in the plurality of fluid pathways based on a transfer of heat from at least one data center heat generating electronic device that is thermally coupled to the evaporator;
changing the working fluid from the liquid phase to the mixed-phase between inlets of the fluid pathways and outlets of the fluid pathways;
flowing a mixed phase of the working fluid out of the plurality of fluid pathways into at least one vapor conduit of the transport member and to the condenser; and
transferring heat from the working fluid in the at least one vapor conduit to the working fluid in a liquid conduit of the transfer member through a heat transfer interface between the liquid conduit and the vapor conduit in the transport member, where the liquid conduit extends through the transport member and comprises an elongated slot at the inlets of the plurality of fluid pathways, and flowing the liquid phase of the working fluid into a fluid channel comprises flowing the liquid phase of the working fluid into a portion of the fluid channel at the inlets of the plurality of fluid pathways.