IP Library › Granted Patent US 11,793,089
Granted Patent B2
US 11,793,089 · App. 16/577,539 · Granted Oct 17, 2023

Durable hybrid heterostructures and methods for manufacturing the same

Inventors: Candice Fanny Thomas (St-Egrève, FR); Michael James Manfra (West Lafayette, IN)
Assignee: Microsoft Technology Licensing, LLC
H10N60/805G06N10/00H10N60/0912H10N60/12H10N60/85
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Quick Facts
Patent No.
US 11,793,089
App. No.
16/577,539
Granted
Oct 17, 2023
Kind
B2
Abstract

A hybrid heterostructure includes a semiconductor layer comprising indium antimonide, a superconductor layer comprising aluminum, and a screening layer between the semiconductor layer and the superconductor layer, the screening layer comprising indium arsenide. By including a screening layer of indium arsenide between the semiconductor layer of indium antimonide and the superconductor layer of aluminum, a high-performance and durable hybrid heterostructure suitable for use in quantum computing devices is provided.

Claims (26)

1. A hybrid heterostructure comprising:

a semiconductor layer only comprising indium antimonide or aluminum indium antimonide;

a superconductor layer comprising aluminum; and

a screening layer between the semiconductor layer and the superconductor layer, the screening layer only comprising indium arsenide.

2. The hybrid heterostructure of claim 1 wherein a thickness of the screening layer is less than 10 monolayers.

3. The hybrid heterostructure of claim 2 wherein the thickness of the screening layer is less than 5 monolayers.

4. The hybrid heterostructure of claim 3 wherein the thickness of the screening layer is 2 monolayers.

5. The hybrid heterostructure of claim 4 wherein the semiconductor layer forms a nanowire such that a width of the semiconductor layer is between 50 nm and 200 nm and a thickness of the semiconductor layer is between 1 nm and 10 nm.

6. The hybrid heterostructure of claim 5 wherein a thickness of the superconducting layer is between 5 nm and 40 nm.

7. The hybrid heterostructure of claim 4 wherein the semiconductor layer only comprises aluminum indium antimonide.

8. The hybrid heterostructure of claim 1 wherein the semiconductor layer forms a nanowire such that a width of the semiconductor layer is between 50 nm and 200 nm and a thickness of the semiconductor layer is between 1 nm and 10 nm.

9. The hybrid heterostructure of claim 8 wherein a thickness of the superconducting layer is between 5 nm and 40 nm.

10. The hybrid heterostructure of claim 1 wherein the semiconductor layer only comprises aluminum indium antimonide.

11. A method for manufacturing a hybrid heterostructure comprising:

providing a semiconductor layer only comprising indium antimonide or aluminum indium antimonide;

providing a superconductor layer, the superconductor layer comprising aluminum; and

providing a screening layer between the semiconductor layer and the superconductor layer, the screening layer only comprising indium arsenide.

12. The method of claim 11 wherein the screening layer is provided such that a thickness of the screening layer is less than 10 monolayers.

13. The method of claim 12 wherein the screening layer is provided such that a thickness of the screening layer is less than 5 monolayers.

14. The method of claim 13 wherein the screening layer is applied such that a thickness of the screening layer is 2 monolayers.

15. The method of claim 14 wherein the semiconductor layer is provided such that the semiconductor layer forms a nanowire wherein a width of the semiconductor layer is between 50 nm and 200 nm and a thickness of the semiconductor layer is between 1 nm and 10 nm.

16. The method of claim 15 wherein the superconducting layer is provided such that a thickness of the superconducting layer is between 5 nm and 40 nm.

17. The method of claim 14 wherein the semiconductor layer only comprises aluminum indium antimonide.

18. The method of claim 11 wherein the semiconductor layer is provided such that the semiconductor layer forms a nanowire wherein a width of the semiconductor layer is between 50 nm and 200 nm and a thickness of the semiconductor layer is between 1 nm and 10 nm.

19. The method of claim 18 wherein the superconducting layer is provided such that a thickness of the superconducting layer is between 5 nm and 40 nm.

20. The method of claim 11 wherein the semiconductor layer only comprises aluminum indium antimonide.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2021
From: THOMAS, CANDICE FANNY; MANFRA, MICHAEL JAMES
To: PURDUE RESEARCH FOUNDATION
Reel/Frame 056787/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2021
From: PURDUE RESEARCH FOUNDATION
To: MICROSOFT CORPORATION
Reel/Frame 056787/0667 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2021
From: MICROSOFT CORPORATION
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 056787/0688 →
Continuity (1)
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