IP Library Granted Patent US 11,128,129
Granted Patent B2
US 11,128,129 · App. 16/579,518 · Granted Sep 21, 2021

Distributed electrostatic discharge scheme to improve analog front-end bandwidth of receiver in high-speed signaling system

Inventors: Kiarash Gharibdoust (Lonay, CH); Suhas Rattan (London, GB); Pallavi Muktesh (Lausanne, CH)
Assignee: KANDOU LABS, S.A.
H02H9/045
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,128,129
App. No.
16/579,518
Granted
Sep 21, 2021
Kind
B2
Abstract

Methods and systems are described for selectively providing a signal path from a respective wire of a multi-wire bus to at least one corresponding data signal output node of at least one set of differential data signal output nodes using a respective switching element in a respective set of signal path circuits connected in parallel, and generating a set of discharge currents, each discharge current of the set of discharge currents generated through a respective resistive element in the respective set of signal path circuits to discharge a portion of a voltage pulse on the respective wire of the multi-wire bus to one or more metallic planes via a respective localized ESD protection circuit, the respective resistive element and the respective localized ESD protection circuit connected between the respective wire and the respective switching element.

Claims (25)

1. An apparatus comprising:

a receiver connected to a multi-wire bus and having at least one set of differential data signal output nodes, wherein each given wire of the multi-wire bus is selectively connected to at least one corresponding data signal output node of the at least one set of differential data signal output nodes via a respective set of signal path circuits connected in parallel, each signal path circuit comprising:

a switching element for selectively providing a signal path from the given wire to the corresponding data signal output node; and

a resistive element and a localized ESD protection circuit connected between the given wire and the switching element to discharge a portion of a voltage pulse on the given wire to one or more metallic planes via the localized ESD protection circuits as a discharge current through the resistive element.

2. The apparatus of claim 1 , wherein each given wire is selectively connected to a single corresponding data signal output node.

3. The apparatus of claim 2 , wherein each set of differential data signal output nodes is configured to output a respective differential signal formed from a respective pair of signals differentially received via a respective pair of wires of the multi-wire bus.

4. The apparatus of claim 1 , wherein at least one wire is selectively connected to corresponding data signal output nodes in at least two different sets of differential data signal output nodes.

5. The apparatus of claim 4 , wherein at least one set of differential data signal output nodes is configured to output a linear combination of signals received via at least three wires of the multi-wire bus.

6. The apparatus of claim 1 , wherein each wire of the multi-wire bus is disconnected from the at least one corresponding data signal output node in a powered-off mode of operation.

7. The apparatus of claim 1 , wherein the respective set of signal path circuits set an impedance between the given wire and the at least one corresponding data signal output node.

8. The apparatus of claim 7 , wherein the impedance between the given wire and the at least one corresponding data signal output node is tunable by a selective connection via of a subset of signal patch circuits of the respective set of signal path circuits.

9. The apparatus of claim 1 , wherein each given wire is connected to the at least one corresponding data signal output node responsive to initiation of a mission mode of operation for data reception.

10. The apparatus of claim 1 , wherein each localized ESD protection circuit is connected to the one or more metallic planes via diode-connected transistors.

11. A method comprising:

selectively providing a signal path from a respective wire of a multi-wire bus to at least one corresponding data signal output node of at least one set of differential data signal output nodes using a respective switching element in a respective set of signal path circuits connected in parallel; and

generating a set of discharge currents, each discharge current of the set of discharge currents generated through a respective resistive element in the respective set of signal path circuits to discharge a portion of a voltage pulse on the respective wire of the multi-wire bus to one or more metallic planes via a respective localized ESD protection circuit, the respective resistive element and the respective localized ESD protection circuit connected between the respective wire and the respective switching element.

12. The method of claim 11 , wherein the respective wire is selectively connected to a single corresponding data signal output node.

13. The method of claim 12 , further comprising outputting a differential signal formed from a pair of signals received differentially via a respective pair of wires of the multi-wire bus.

14. The method of claim 11 , wherein at least one wire is selectively connected to corresponding data signal output nodes in at least two different sets of differential data signal output nodes.

15. The method of claim 14 , further comprising outputting a linear combination of at least three signals received via a respective at least three wires of the multi-wire bus on at least one set of differential data signal output nodes.

16. The method of claim 11 , wherein each wire of the multi-wire bus is disconnected from the at least one corresponding data signal output node in a powered-off mode of operation.

17. The method of claim 11 , wherein the respective set of set of signal path circuits set an impedance between the respective wire and the at least one corresponding data signal output node.

18. The method of claim 17 , further comprising tuning the impedance between the given wire and the at least one corresponding data signal output node by a selective connection via of a subset of signal patch circuits of the respective set of signal path circuits.

19. The method of claim 11 , wherein each given wire is connected to the at least one corresponding data signal output node responsive to initiation of a mission mode of operation for data reception.

20. The method of claim 11 , wherein the respective localized ESD protection circuit is connected to the one or more metallic planes via diode-connected transistors.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2020
From: RATTAN, SUHAS; GHARIBDOUST, KIARASH
To: KANDOU LABS, S.A.
Reel/Frame 052735/0906 →
Continuity (2)
Provisional Application 62831168 · Apr 8, 2019
Related Publication 20200321778A1 · Oct 8, 2020