Application specific electronics packaging systems, methods and devices
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel ( 68 a, 68 b ) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
1. A method of manufacturing electronic devices comprising:
forming a continuous carrier formed of an electrically conductive material;
molding a plurality of non-conductive substrates onto the carrier;
forming traces on the substrates;
electroplating the traces;
electrically attaching components to the traces to form a plurality of devices;
singulating one of the devices from the remainder of the carrier, wherein pockets are molded into the substrates such that portions of the carrier are exposed and vias are formed within at least one of the pockets.
2. The method of claim 1 , wherein forming the traces comprises:
ablating the substrate with a laser;
depositing an ink on the ablated surface; and
sintering the ink.
3. A device comprising:
a singulated carrier portion;
a substrate molded onto the singulated carrier portion;
seed layer traces on the substrate;
plated metal traces on the seed layer traces; and
a component electrically attached to at least one plated metal trace, wherein a pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed and a via is formed within the pocket.
4. The device of claim 3 , wherein the device comprises at least one of a printed circuit board, a flex circuit, a connector, a thermal management feature, EMI shielding, a high current conductor, an RFID apparatus, an antenna, a wireless power device, a sensor, a MEMS apparatus, an LED device, a microprocessor, a memory device, an ASIC, a passive device, an impedance control device, and an electro-mechanical apparatus.
5. The device of claim 3 , wherein the component is seated within the pocket formed in the substrate.
6. The device of claim 3 , wherein the singulated carrier portion comprises metal.
7. The device of claim 3 , wherein the singulated carrier portion comprises a flex material.
8. The device of claim 7 , wherein the flex material comprises a polyimide flex material.
9. The device of claim 3 , wherein the plated metal traces comprise electroplated plated metal traces.
10. The device of claim 3 , wherein the seed layer traces comprise sintered ink.
11. The device of claim 3 , wherein the seed layer traces comprise sintered paste.
12. A device comprising:
a singulated carrier portion;
a substrate molded onto the singulated carrier portion;
conductive traces formed on the substrate with a laser and electroplating;
a component electrically coupled to at least one of the conductive traces, wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed and a via is formed within the pocket.
13. The device of claim 12 , wherein the device comprises at least one of a printed circuit board, a flex circuit, a connector, a thermal management feature, EMI shielding, a high current conductor, an RFID apparatus, an antenna, a wireless power device, a sensor, a MEMS apparatus, an LED device, a microprocessor, a memory device, an ASIC, a passive device, an impedance control device, and an electro-mechanical apparatus.
14. The device of claim 12 , wherein the component is seated within the pocket formed in the substrate.
15. The device of claim 12 , wherein the singulated carrier portion comprises metal.
16. The device of claim 12 , wherein the singulated carrier portion comprises a flex material.
17. The device of claim 16 , wherein the flex material comprises a polyimide flex material.