IP Library › Granted Patent US 10,667,383
Granted Patent B2
US 10,667,383 · App. 16/581,098 · Granted May 26, 2020

Printed circuit board and switching power supply for electronic appliance

Inventors: Shingo Hashiguchi (Kyoto, JP); Shoichi Harada (Kyoto, JP)
Assignee: Rohm Co., Ltd.
H05K1/0236G05F1/10H01L27/0207H03K17/161H05K1/0234H05K1/0231H05K2201/10053
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Quick Facts
Patent No.
US 10,667,383
App. No.
16/581,098
Granted
May 26, 2020
Kind
B2
Abstract

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

Claims (40)

1. A printed circuit board comprising:

a first wiring pattern; and

a second wiring pattern,

wherein

a first ring-shaped current path is formed across the first wiring pattern,

a second ring-shaped current path is formed across the second wiring pattern,

a direction of a current flowing across the first ring-shaped current path and a direction of a current flowing across the second ring-shaped current path are opposite to each other,

the first and second ring-shaped current paths are located above each other in a thickness direction of the printed circuit board,

at least part of a first region surrounded by the first ring-shaped current path and at least part of a second region surrounded by the second ring-shaped current path overlap each other as seen in a plan view of the printed circuit board.

2. The printed circuit board according to claim 1 , further comprising:

a first conductive member connected to the first ring-shaped current path, the first conductive member letting a current flow in a first direction pointing from the first ring-shaped current path to the second ring-shaped current path.

3. The printed circuit board according to claim 2 , further comprising:

a second conductive member connected to the second ring-shaped current path, the second conductive member letting a current flow in a second direction pointing from the second ring-shaped current path to the first ring-shaped current path.

4. The printed circuit board according to claim 3 , wherein

the first and second conductive members are located next to each other.

5. The printed circuit board according to claim 1 , wherein

a capacitor is disposed in at least one of the first and second ring-shaped current paths.

6. The printed circuit board according to claim 1 , wherein

a switching device is disposed in at least one of the first and second ring-shaped current paths.

7. The printed circuit board according to claim 2 , wherein

the first conductive member is connected also to the second ring-shaped current path.

8. The printed circuit board according to claim 3 , wherein

the second conductive member is connected also to the first ring-shaped current path.

9. The printed circuit board according to claim 1 , wherein

the first and second ring-shaped current paths are both in a shape of an open ring.

10. The printed circuit board according to claim 3 , wherein

the first and second conductive members are twisted around each other.

11. The printed circuit board according to claim 3 , comprising a plurality of sets each comprising the first wiring pattern, the second wiring pattern, the first conductive member, and the second conductive member.

12. A switching power supply comprising:

the printed circuit board according to claim 1 ; and

a switching output stage and a bypass capacitor mounted on the printed circuit board to form, along with the first wiring pattern, the first ring-shaped current path.

13. The switching power supply according to claim 12 , wherein

the switching output stage is integrated into a semiconductor device.

14. The switching power supply according to claim 13 , wherein

the bypass capacitor is disposed near the semiconductor device.

15. The switching power supply according to claim 12 , wherein

spectrum spreading is applied to a driving frequency of the switching output stage.

16. An electronic appliance comprising:

the switching power supply according to claim 12 ; and

a load operating by being supplied with electric power from the switching power supply.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2019
From: HASHIGUCHI, SHINGO; HARADA, SHOICHI
To: ROHM CO., LTD.
Reel/Frame 050653/0621 →
Priority Claims (1)
JP 2017-042891 · Mar 7, 2017 · national
Continuity (2)
Continuation 15912907 · Mar 6, 2018
Related Publication 20200022253A1 · Jan 16, 2020