Interconnection with side connection to substrate
An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.
1. An interconnection structure comprising:
a support substrate;
a release layer formed on the support substrate; and
an interconnection layer part disposed on the release layer and having an edge, the interconnection layer part including:
an insulation material, and
a set of side connection pads embedded in the insulation material, the set of the side connection pads being located and exposed at the edge of the interconnection layer part and formed along the edge of the interconnection layer part with a predetermined interval.
2. The interconnection structure of claim 1 , wherein each side connection pad has a bottom surface exposed at a bottom surface of the interconnection layer part and an edge surface exposed at the edge of the interconnection layer part.
3. The interconnection structure of claim 1 , wherein each side connection pad is configured to be connected by a solder joint to a corresponding conductive pad disposed on a base substrate for receiving the interconnection layer part transferred thereto.
4. A method for fabricating an interconnection structure, the method comprising:
preparing a support substrate;
applying a release layer on the support substrate; and
building an interconnection layer part on the release layer, the interconnection layer part having an edge and including:
an insulation material, and
a set of side connection pads embedded in the insulation material, the set of the side connection pads being located and exposed at the edge of the interconnection layer part and formed along the edge of the interconnection layer part with a predetermined interval.
5. The method of claim 4 , wherein building the interconnection layer part comprises:
patterning conductive material to provide the set of the side connection pads on the release layer; and
forming an insulation part on the release layer so as to embed the set of the side connection pads.
6. The method of claim 5 , wherein building the interconnection layer part includes:
forming a set of first bond pads on the release layer;
patterning wiring configured to connect each side connection pad of the set of side connection pads with a corresponding bond pad of the set of first bond pads; and
forming a second insulation part to embed the wiring.
7. The method of claim 6 , wherein building the interconnection layer part further includes:
forming a second bond pad and a third bond pad on the release layer;
patterning a trace for connecting the second bond pad and the third bond pad; and
forming a third insulation part to embed the trace.
8. The method of claim 5 , further comprising: cutting the support substrate together with a structure on the support substrate through the patterned conductive material to complete the interconnection layer part and the set of the side connection pads.
9. The method of claim 5 , wherein the insulation part is patterned so as to expose at least an edge surface of each side connection pad from the insulation parts, the method further comprising: cutting the support substrate at a position away from the set of the side connection pads.