Test apparatuses including probe card for testing semiconductor devices and operation methods thereof

1. A test apparatus, comprising:

a tester, the tester including a voltage supply and a controller; and

a probe card, the probe card including a first probe and a first sensing pin,

wherein the first probe is configured to be electrically connected to both an output port of the voltage supply and an electrode pad of a first semiconductor device,

wherein the first sensing pin is configured to be electrically connected to both the controller and a sensing pad of the first semiconductor device and is configured to sense a voltage of the first semiconductor device through the sensing pad and transmit the sensed voltage to the controller,

wherein the controller is electrically connected to both the voltage supply and the first sensing pin and is configured to

cause the voltage supply to provide an initial voltage to the electrode pad of the first semiconductor device via the first probe,

receive the sensed voltage from the first sensing pin,

determine a difference between the initial voltage and the sensed voltage,

determine an adjustment of the initial voltage based on the determined difference to determine a corrected voltage, and

cause the voltage supply to provide the corrected voltage to the sensing pad of the first semiconductor device via the first sensing pin.

2. The test apparatus of claim 1 , wherein

the probe card further includes a first switch connected between the output port of the voltage supply and the first probe, and

the first switch is configured to control an electrical connection between the output port of the voltage supply and the first probe.

3. The test apparatus of claim 2 , wherein:

the probe card further includes a second switch connected between the controller and the first sensing pin, and

the second switch is configured to control an electrical connection between the controller and the first sensing pin.

4. The test apparatus of claim 1 , wherein a positive input port of the voltage supply and a negative input port of the voltage supply are each electrically connected to the controller.

5. The test apparatus of claim 1 , wherein the electrode pad of the first semiconductor device and the sensing pad of the first semiconductor device are directly connected to each other.

6. The test apparatus of claim 1 , wherein the first sensing pin has a thickness greater than a thickness of each pin of a plurality of pins of the first probe.

7. The test apparatus of claim 1 , wherein

the probe card further includes a second probe and a second sensing pin,

the second probe is configured to be electrically connected to both the output port of the voltage supply and an electrode pad of a second semiconductor device, and

the second sensing pin is configured to be electrically connected to both the controller and a sensing pad of the second semiconductor device.

8. The test apparatus of claim 7 , wherein

the probe card further includes a switch connected between the controller and the first and second sensing pins,

one end of the switch is connected to the controller and another end of the switch is connected to both the first sensing pin and the second sensing pin, and

the switch is configured to control an electrical connection between the controller and the first and second sensing pins.

9. A test apparatus, comprising:

a tester, the tester including a first voltage supply, a second voltage supply, and a controller; and

a probe card, the probe card including a first probe, a second probe, a first sensing pin, and a second sensing pin,

wherein the first probe is configured to be electrically connected to both an output port of the first voltage supply and a first electrode pad of a first semiconductor device,

wherein the first sensing pin is configured to be electrically connected to both the controller and a first sensing pad of the first semiconductor device and is configured to sense a voltage of the first semiconductor device through the first sensing pad and transmit the sensed voltage to the controller,

wherein the controller is electrically connected to both the first voltage supply said the first sensing pin and is eon figured to

cause the first voltage supply to provide an initial voltage to the first electrode pad of the first semiconductor device via the first probe,

receive the sensed voltage from the first sensing pin,

determine a difference between the initial voltage and the sensed voltage,

determine an adjustment of the initial voltage based on the determined difference to determine a corrected voltage, and

cause the first voltage supply to provide the corrected voltage to the first sensing pad of the first semiconductor device via the first sensing pin,

wherein the second probe is configured to be electrically connected to both an output port of the second voltage supply and a second electrode pad of the first semiconductor device,

wherein the second sensing pin is configured to be electrically connected to both the controller and a second sensing pad of the first semiconductor device.

10. The test apparatus of claim 9 , wherein the controller includes a first controller and a second controller, and

the first sensing pin is configured to electrically connected to the first controller, and the second sensing pin is configured to electrically connected to the second controller.

11. The test apparatus of claim 10 , wherein

the probe card further includes a third probe, a fourth probe, a third sensing pin, and a fourth sensing pin,

the third probe is configured to be electrically connected to both the output port of the first voltage supply and a third electrode pad of a second semiconductor device,

the third sensing pin is configured to be electrically connected to both the first controller and a third sensing pad of the second semiconductor device,

the fourth probe is configured to be electrically connected to both the output port of the second voltage supply and a fourth electrode pad of the second semiconductor device, and

the fourth sensing pin is configured to be electrically connected to both the second controller and a fourth sensing pad of the second semiconductor device.

12. The test apparatus of claim 11 , wherein the probe card further includes a first switch and a second switch, and

wherein the first switch is connected between the output port of the first voltage supply and one end of the first probe, and

wherein the second switch is connected between the output port of the first voltage supply and one end of the third probe.

13. A probe card, comprising:

a first probe;

a first sensing pin;

a second sensing pin;

a first repeater connected between an output port of a first voltage supply of a tester and the first probe; and

a second repeater connected between a first controller and the first sensing pin,

wherein the first probe is configured to be electrically connected to the output port of the first voltage supply of the tester, and a first electrode pad of a first semiconductor device,

wherein the first sensing pin is configured to be electrically connected to both the first, controller of the tester and a first sensing pad of the first semiconductor device,

wherein the second sensing pin is configured to be electrically connected to a second sensing pad of the first semiconductor device.

14. The probe card of claim 13 , further including a third repeater connected between the first controller and the second sensing pin.

15. The probe card of claim 13 , further including:

a second probe;

a third sensing pin; and

a fourth sensing pin,

wherein:

the second sensing pin is configured to be electrically connected to both a second controller and the second sensing pad of the first semiconductor device,

the second probe is configured to be electrically connected to both an output port of a second voltage supply of the tester and a second electrode pad of a second semiconductor device,

the third sensing pin is configured to be electrically connected to both the first controller and a third sensing pad of the second semiconductor device, and

the fourth sensing pin is configured to be electrically connected to both the second controller and a fourth sensing pad of the second semiconductor device.

16. The probe card of claim 15 , further including a third repeater connected between the output port of the second voltage supply and the second probe.

17. The probe card of claim 15 , further including a third repeater connected between the first controller and the third sensing pad of the second semiconductor device.

18. The probe card of claim 15 , further including a third repeater connected between the second controller and the fourth sensing pad of the second semiconductor device.