IP Library › Granted Patent US 11,024,520
Granted Patent B2
US 11,024,520 · App. 16/588,178 · Granted Jun 1, 2021

Substrate processing apparatus

Inventors: Keiichi Kurashina (Tokyo, JP); Toshio Yokoyama (Tokyo, JP)
Assignee: EBARA CORPORATION
H01L21/67057H01L21/6708H01L21/67086H01L21/67751H01L21/68707
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Quick Facts
Patent No.
US 11,024,520
App. No.
16/588,178
Granted
Jun 1, 2021
Kind
B2
Abstract

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

Claims (9)

1. A substrate processing apparatus comprising:

a substrate holder for holding a substrate;

a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber;

a porous member secured to an upper portion of the processing chamber, the porous member having an upper surface and a lower surface, the porous member locating a surface of the processing liquid between the upper surface and the lower surface of the porous member;

a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end located above the porous member; and

a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to supply the processing liquid onto the porous member through the liquid delivery pipe,

wherein the pump supplies the processing liquid onto the porous member until the surface of the processing liquid is located between the upper surface and the lower surface of the porous member.

2. The substrate processing apparatus according to claim 1 , wherein the porous member has a hole to pass the substrate holder.

3. The substrate processing apparatus according to claim 1 , wherein the other end of the liquid delivery pipe is branched on both sides of the substrate held by the substrate holder.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2019
From: KURASHINA, KEIICHI; YOKOYAMA, TOSHIO
To: EBARA CORPORATION
Reel/Frame 050907/0077 →
Priority Claims (1)
JP 2015-060284 · Mar 24, 2015 · national
Continuity (2)
Division 15076265 · Mar 21, 2016
Related Publication 20200027758A1 · Jan 23, 2020