Single-package wireless communication device

1. A system, comprising:

a first die flip-chip electrically coupled to a package substrate upon a first layer thereof, wherein the package substrate is bumped on a second layer opposite the first layer, with an array of solder balls to electrically and mechanically couple to a printed circuit board;

wherein the array of solder balls includes:

a first plurality of solder regions at a bottom of the second layer, each region having a cross-sectional area less than a first value;

a second plurality of solder regions at the bottom of the second layer providing grounding for a radio transceiver, each region having a cross-sectional area of value that is different than the first value;

a Base Band/Communication processor electrically wirebonded to the package substrate at the first layer thereof, wherein the Base Band/Communication processor is mechanically coupled to the first die;

a memory die physically and electrically coupled to the Base Band/Communication processor, the memory die being electrically connected to the first die and physically connected to the Base Band/Communication processor;

a package cover that covers the first die, the wire bond die, and the memory die; and

at least one passive device on the die side of the package substrate.

2. The system of claim 1 , wherein the package cover is a heat spreader.

3. The system of claim 1 , further including an antenna coupled to the Base Band/Communication processor.

4. The system of claim 1 , further including at least one passive component, disposed on the package substrate.

5. The system of claim 1 , further including an underfill that touches the memory die and the Base Band/Communication processor.

6. The system of claim 1 , further including:

an antenna coupled to the Base Band/Communication processor, wherein the antenna extends including the first layer and the second layer.

7. The system of claim 1 , further including:

an antenna coupled to the Base Band/Communication processor, wherein the antenna extends including the first layer and the second layer; and

wherein the at least one passive component, disposed on the first layer is selected from an inductor component and a switching component.

8. The system of claim 1 , further including:

an antenna coupled to the Base Band/Communication processor, wherein the antenna extends including the first layer and the second layer;

an underfill that touches the memory die and the Base Band/Communication processor,

wherein the at least one passive component, disposed on the first layer includes two passive components including an inductor component and a switching component; and

an underfill that touches the memory die and the Base Band/Communication processor.

9. The system of claim 1 , further including:

an antenna coupled to the Base Band/Communication processor, wherein the antenna contacts the first layer and the second layer, and wherein the antenna contacts the package cover, and wherein the package cover contacts the first layer.

10. The system of claim 1 , further including:

an antenna coupled to the Base Band/Communication processor, wherein the antenna contacts the first layer and the second layer, and wherein the antenna contacts the package cover, and wherein the package cover contacts the first layer; and

an underfill that touches the memory die and the Base Band/Communication processor.

11. A system, comprising:

a first die flip-chip electrically coupled to a package substrate upon a first layer thereof,

wherein the package substrate is bumped opposite the first layer on a second layer at a bottom, with an array of solder bans to electrically and mechanically couple to a printed circuit board;

a Base Band/Communication processor electrically wirebonded to the package substrate at the first layer thereof, wherein the Base Band/Communication processor is mechanically coupled to the first die;

a memory die physically and electrically coupled to the Base Band/Communication processor, the memory die being electrically connected to the first die and physically connected to the Base Band/Communication processor;

an antenna coupled to the Base Band/Communication processor;

an epoxy that touches the memory die and the Base Band/Communication processor; and

two passive components on the first layer.

12. The system of claim 11 , wherein the epoxy is an underfill.

13. The system of claim 11 , further including: a package cover that covers the first die, the wire bond die, and the memory die.

14. The system of claim 11 , further wherein the two passive components include an inductor component and a switching component.

15. The system of claim 11 , further including:

an antenna that passes into the package substrate at the first side;

wherein the epoxy is an underfill;

a package cover that covers the first die, the wire bond die, and the memory die; and

wherein the two passive components include an inductor component and a switching component;

wherein the antenna contacts the package cover, and wherein the package cover contacts the first layer.

16. A system, comprising:

a first die flip-chip electrically coupled to a package substrate upon a first layer thereof, wherein the package substrate is bumped opposite the first layer at a second layer at a bottom of the second layer, with an array of solder balls to electrically and mechanically couple to a printed circuit board;

a Base Band/Communication processor electrically wirebonded to the package substrate at the first layer thereof, wherein the Base Band/Communication processor is mechanically coupled to the first die;

a memory die physically and electrically coupled to the Base Band/Communication processor, the memory die being electrically connected to the first die and physically connected to the Base Band/Communication processor;

an antenna coupled to the Base Band/Communication processor, wherein the antenna passes into the package substrate at the first layer;

an epoxy that touches the memory die and the Base and/Communication processor, wherein the epoxy is an underfill; and

a package cover that covers the first die, the wire bond die, and the memory die.

17. The system of claim 16 , wherein the antenna is a copper stud.

18. The system of claim 16 , wherein the antenna is disposed in the package substrate and grounded at the second layer thereof, and wherein a group of the array of solder balls is grouped and capable of reflowing and coalescing where the antenna is grounded.

19. The system of claim 16 , wherein the antenna is a copper stud.

20. The system of claim 19 , wherein the antenna is disposed in the package substrate, and wherein a group of the array of solder balls is grouped and capable of reflowing and coalescing.