Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. The at least one interconnect element is undetectable by x-ray, and the conductive lines are detectable by x-ray. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.
1. A tamper-respondent assembly comprising:
at least one tamper-respondent sensor including:
an insulative layer comprising a first side and a second side, the first side and the second side being opposing sides of the insulative layer;
conductive lines disposed on the first side and the second side of the insulative layer and patterned to form, at least in part, at least one tamper-detect network of the at least one tamper-respondent sensor; and
at least one interconnect via electrically connecting multiple conductive lines of the conductive lines forming, at least in part, the at least one tamper-detect network, the at least one interconnect via electrically connecting the conductive lines on the first side and the second side of the insulative layer, and comprising an unfilled opening extending through the insulative layer between the first side and second side thereof, and at least one interconnect characteristic selected to obscure a circuit layout of the at least one tamper-detect network, the at least one interconnect characteristic being an electrical interconnect material layer coating a wall of the unfilled opening extending through the insulative layer, the electrical interconnect material layer having a minimal coating thickness which makes the electrical interconnect material layer undetectable visually and by x-ray, and wherein in cross-section, the at least one interconnect via appears as at least one unused interconnect via, with the unfilled opening extending through the insulative layer; and
wherein the electrical connection of the at least one interconnect via to the multiple conductive lines disposed on the opposing sides of the insulative layer is undetectable in an x-ray image of the at least one tamper-respondent sensor, and the conductive lines are detectable in the x-ray image of the at least one tamper-respondent sensor; and
a detector to monitor the at least one tamper-detect network of the at least one tamper-respondent sensor for a tamper event.
2. The tamper-respondent assembly of claim 1 , wherein the at least one interconnect characteristic comprises an interconnect material that is undetectable by x-ray, the at least one interconnect via being formed of the interconnect material.
3. The tamper-respondent assembly of claim 2 , wherein the conductive lines are formed of a conductive material, the conductive material and the interconnect material being different materials.
4. The tamper-respondent assembly of claim 2 , wherein the interconnect material is a material selected from the group consisting of carbon ink, a nickel-phosphorous (NiP) material, or a nickel-chromium (NiCr) material.
5. The tamper-respondent assembly of claim 1 , wherein the electrical interconnect material layer is an electroless seed layer.
6. The tamper-respondent assembly of claim 1 , wherein the insulative layer is a flexible insulative layer.
7. A tamper-respondent assembly comprising:
at least one electronic component;
an enclosure surrounding, at least in part, the at least one electronic component;
at least one tamper-respondent sensor associated with the enclosure and facilitating defining a secure volume about the at least one electronic component, the at least one tamper-respondent sensor including:
an insulative layer comprising a first side and a second side, the first side and the second side being opposing sides of the insulative layer;
conductive lines disposed on the first side and the second side of insulative layer and patterned to form, at least in part, at least one tamper-detect network of the at least one tamper-respondent sensor; and
at least one interconnect via electrically connecting multiple conductive lines of the conductive lines forming, at least in part, the at least one tamper-detect network, the at least one interconnect via electrically connecting the conductive lines on the first side and the second side of the insulative layer, and comprising an unfilled opening extending through the insulative layer between the first side and second side thereof, and at least one interconnect characteristic selected to obscure a circuit layout of the at least one tamper-detect network, the at least one interconnect characteristic being an electrical interconnect material layer coating a wall of the unfilled opening extending through the insulative layer, the electrical interconnect material layer having a minimal coating thickness which makes the electrical interconnect material layer undetectable visually and by x-ray, and wherein in cross-section, the at least one interconnect via appears as at least one unused interconnect via, with the unfilled opening extending through the insulative layer; and
wherein the electrical connection of the at least one interconnect via to the multiple conductive lines disposed on the opposing sides of the insulative layer is undetectable in an x-ray image of the at least one tamper-respondent sensor, and the conductive lines are detectable in the x-ray image of the at least one tamper-respondent sensor; and
a detector to monitor the at least one tamper-detect network of the at least one tamper-respondent sensor for a tamper event.
8. The tamper-respondent assembly of claim 7 , wherein the at least one interconnect characteristic comprises an interconnect material that is undetectable by x-ray, the at least one interconnect via being formed of the interconnect material.
9. The tamper-respondent assembly of claim 8 , wherein the conductive lines are formed of a conductive material, the conductive material and the interconnect material being different materials.
10. The tamper-respondent assembly of claim 8 , wherein the interconnect material is a material selected from the group consisting of carbon ink, a nickel-phosphorous (NiP) material, or a nickel-chromium (NiCr) material.
11. The tamper-respondent assembly of claim 7 , wherein the electrical interconnect material layer is an electroless seed layer.
12. The tamper-respondent assembly of claim 7 , wherein the insulative layer is a flexible insulative layer.
13. A fabrication method comprising:
fabricating a tamper-respondent assembly, the fabricating comprising:
providing at least one tamper-respondent sensor including:
an insulative layer comprising a first side and a second side, the first side and the second side being opposing sides of the insulative layer;
conductive lines disposed on the first side and the second side of the insulative layer and patterned to form, at least in part, at least one tamper-detect network of the at least one tamper-respondent sensor; and
at least one interconnect via electrically connecting multiple conductive lines of the conductive lines forming, at least in part, the at least one tamper-detect network, the at least one interconnect via electrically connecting the conductive lines on the first side and the second side of the insulative layer, and comprising an unfilled opening extending through the insulative layer between the first side and second side thereof, and at least one interconnect characteristic selected to obscure a circuit layout of the at least one tamper-detect network, the at least one interconnect characteristic being an electrical interconnect material layer coating a wall of the unfilled opening extending through the insulative layer, the electrical interconnect material layer having a minimal coating thickness which makes the electrical interconnect material layer undetectable visually and by x-ray, and wherein in cross-section, the at least one interconnect via appears as at least one unused interconnect via, with the unfilled opening extending through the insulative layer; and
wherein the electrical connection of the at least one interconnect via to the multiple conductive lines disposed on the opposing sides of the insulative layer is undetectable in an x-ray image of the at least one tamper-respondent sensor, and the conductive lines are detectable in the x-ray image of the at least one tamper-respondent sensor; and
providing a detector to monitor the at least one tamper-detect network of the at least one tamper-respondent sensor for a tamper event.
14. The fabrication method of claim 13 , wherein the electrical interconnect material layer is an electroless seed layer.
15. The tamper-respondent assembly of claim 13 , wherein the insulative layer is a flexible insulative layer.