FILLER FOR RESINOUS COMPOSITION, FILLER-CONTAINING SLURRY COMPOSITION AND FILLER-CONTAINING RESINOUS COMPOSITION
A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.
1 : A filler for resinous composition, which is contained and used in resinous composition for use in electronic packaging material, comprising:
a crystalline siliceous particulate material with at least one crystal structure selected from the group consisting of FAU, FER, LTA and MFI, and MWW; and
a surface treatment agent comprising an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material,
an amount of the surface treatment agent falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.
2 : A filler for resinous composition, which is contained and used in resinous composition, comprising:
a crystalline siliceous particulate material with at least one crystal structure selected from the group consisting of FAU, FER, LTA and MFI, and MWW; and
a surface treatment agent comprising an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material,
an amount of the surface treatment agent falling in a range allowing the filler to exhibit a negative thermal expansion coefficient, and
the filler having a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt or nickel is not exposed.
3 : The filler according to claim 1 , wherein the organic silicon compound comprises at least one member selected from the group consisting of a silazane and a silane coupling agent.
4 : The filler according to claim 2 , wherein the organic silicon compound comprises at least one member selected from the group consisting of a silazane and a silane coupling agent.
5 : The filler according to claim 1 , having an aluminum element content of 12% or less based on an entire mass thereof.
6 : The filler according to claim 2 , having an aluminum element content of 12% or less based on an entire mass thereof.
7 : The filler according to claim 1 , wherein the crystal structure is FAU.
8 : The filler according to claim 2 , wherein the crystal structure is FAU.
9 : A filler-containing resinous composition for packaging material comprising:
the filler according to claim 1 ; and
a resinous material dispersing the filler.
10 : A filler-containing resinous composition for packaging material comprising:
the filler according to claim 2 ; and
a resinous material dispersing the filler.
11 : A filler-containing slurry composition comprising:
a filler for resinous composition; and
a solvent dispersing the filler, the filler comprising:
a crystalline siliceous particulate material with at least one crystal structure selected from the group consisting of FAU, FER, LTA and MFI, and MWW; and
a surface treatment agent comprising an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material.
12 : The filler-containing slurry composition according to claim 11 , wherein the organic silicon compound comprises at least one member selected from the group consisting of a silazane and a silane coupling agent.
13 : The filler-containing slurry composition according to claim 11 , having an aluminum element content of 12% or less based on an entire mass thereof.
14 : The filler-containing slurry composition according to claim 11 , wherein the crystal structure is FAU.