Systems and methods for efficient transfer of semiconductor elements
Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the support structure such that the surface of the film faces a support surface of the support structure. The film can be selectively positioned laterally relative to the support structure such that a selected first die is aligned with a first location of the support structure. A force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the film to the support structure.
1. A processing system comprising:
a control system configured to:
select a first element from a plurality of singulated elements on a surface of a film which supports the plurality of singulated elements;
send instructions to a movable apparatus to cause the movable apparatus to position the film adjacent a support structure such that the surface of the film faces a support surface of the support structure;
send instructions to the movable apparatus to cause the movable apparatus to selectively position the film laterally relative to the support structure such that the first element is aligned with a first location of the support structure; and
send instructions to a release assembly to cause the release assembly to apply a force to at least one of the support structure and the film in a direction nonparallel to the surface of the film to cause the first element to be transferred from the film to the support structure, such that the first element is removed from the film.
2. The processing system of claim 1 , further comprising the movable apparatus.
3. The processing system of claim 1 , further comprising the release assembly.
4. The processing system of claim 3 , wherein the release assembly comprises a plunger.
5. The processing system of claim 3 , wherein the release assembly comprises one or more nozzles configured to supply a fluid to a backside of the film.
6. The processing system of claim 5 , wherein the one or more nozzles comprises a plurality of orifices, wherein a first orifice at a first end of the release assembly is wider than a second orifice at a second end of the release assembly.
7. The processing system of claim 5 , wherein the one or more nozzles comprises a plurality of orifices, wherein a first orifice in a central region of the release assembly is wider than orifices at end portions of the release assembly.
8. The processing system of claim 3 , wherein the release assembly comprises a first collet having a plurality of first fingers spaced apart by one or more first gaps.
9. The processing system of claim 8 , wherein the release assembly further comprises a second collet having a plurality of second fingers spaced apart by one or more second gaps, the first and second collets configured to move towards and away from one another along the direction.
10. The processing system of claim 9 , wherein the second fingers are dimensioned such that, when the first and second collets are brought together, at least one second finger is disposed within a corresponding first gap and at least one first finger is disposed within a corresponding second gap.
11. The processing system of claim 1 , wherein the control system configured to select a first known good element from the plurality of singulated elements, the first known good element having properly-functioning non-electrical characteristics, the first element comprising the first known good element.
12. The processing system of claim 11 , wherein the plurality of singulated elements comprise a plurality of singulated integrated device dies and the first known good element comprises a first known good die.
13. The processing system of claim 1 , wherein the support structure comprises a wafer or wafer stack, a die or die stack, a reconstituted wafer, a panel, a reconstituted panel, a printed circuit board, an interposer, a glass substrate, a plastic substrate, packaging structure, or a ceramic substrate.
14. The processing system of claim 1 , wherein the control system is configured to:
select a second element from the plurality of singulated elements, the second element being different from the first element;
send instructions to the movable apparatus to cause the movable apparatus to selectively position the film laterally relative to the support structure such that the second element is aligned with a second location of the support structure; and
send instructions to the release assembly to cause the release assembly to apply the force to at least one of the support structure and the film in the direction nonparallel to the surface of the film to cause the second element to be transferred from the film to the support structure, such that the second element is removed from the film.
15. The processing system of claim 14 , wherein the second location of the support structure and the first location of the support structure are the same and the second element is stacked on the first element.
16. The processing system of claim 15 , wherein the first element and the second element are directly bonded without an intervening adhesive.
17. The processing system of claim 14 , wherein the second location is different from the first location and a gap between the first element and the second element is filled with a filling material.
18. The processing system of claim 1 , wherein the first element is directly bonded to the support structure without an intervening adhesive.
19. The processing system of claim 1 , wherein the film is wider than at least two singulated elements of the plurality of singulated elements.
20. The processing system of claim 1 , wherein the support surface of the support structure comprises a web of a substrate material.