Systems and methods for efficient transfer of semiconductor elements
Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the support structure such that the surface of the film faces a support surface of the support structure. The film can be selectively positioned laterally relative to the support structure such that a selected first die is aligned with a first location of the support structure. A force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the film to the support structure.
1. A method for mounting elements on a support structure, the method comprising:
receiving a plurality of singulated elements after a substrate has been singulated to define the plurality of singulated elements;
providing a film;
placing the plurality of singulated elements to be supported by the film, the plurality of singulated elements disposed adjacent one another along a surface of the film;
positioning the film adjacent the support structure such that the surface of the film faces a support surface of the support structure, the support structure comprising a packaging structure;
selectively positioning the film laterally relative to the support structure such that a selected first element is aligned with a first location of the support structure; and
applying a force in a direction nonparallel to the surface of the film to cause the selected first element to be directly transferred from the film to the packaging structure, such that the first element is removed from the film.
2. The method of claim 1 , further comprising singulating the substrate on the film to define the plurality of singulated elements.
3. The method of claim 1 , wherein the plurality of singulated elements comprise a plurality of singulated integrated device dies, the method further comprising selecting a first known good die from the plurality of singulated integrated device dies, the first known good die having properly-functioning electrical characteristics, the selected first die comprising the first known good die.
4. The method of claim 1 , further comprising adjusting the film or the support structure in a lateral direction parallel to the surface of the film to align the selected first element with the first location.
5. The method of claim 1 , wherein the film comprises an adhesive sheet attached to a backside of the plurality of singulated elements and supported by a frame.
6. The method of claim 1 , further comprising:
selecting a second element from the plurality of singulated elements;
repositioning the support structure laterally relative to the film such that the second element is aligned with a selected location on the support structure; and
applying a second force to at least one of the support structure and the film in a direction nonparallel to the surface of the film to cause the selected second element to be transferred directly from the film to the packaging structure.
7. The method of claim 1 , further comprising stacking at least some of the singulated elements onto another corresponding plurality of elements.
8. The method of claim 1 , further comprising filling gaps between adjacent elements on the support structure with a filling material.
9. The method of claim 1 , further comprising polishing a front side of the selected first element with the first element on the film, terminating the front side of the selected first element with a species with the first element on the film, and activating the front side of the selected first element with a species with the first element on the film.
10. The method of claim 9 , further comprising directly bonding the selected first element to another element without an intervening adhesive.
11. A method for bonding elements, the method comprising:
providing a film which supports first plurality of singulated elements, the first plurality of singulated elements disposed adjacent one another along a first surface of the film;
providing a support structure which supports a second plurality of elements, the second plurality of elements disposed adjacent one another along a second surface of the support structure;
positioning the film adjacent the support structure such that a selected first element from the first plurality of singulated elements is aligned with and faces a second element from the second plurality of singulated elements;
applying a force in a direction nonparallel to the first surface of the film to cause the first element to contact the second element;
directly bonding the first element with the second element; and
removing the first element from the film.
12. The method of claim 11 , wherein the first plurality of diced elements comprises a first plurality of diced integrated device dies, and wherein the second plurality of diced elements comprises a second plurality of diced integrated device dies.
13. The method of claim 11 , further comprising singulating the second plurality of elements before applying the force and directly bonding.
14. The method of claim 11 , wherein positioning the film comprises selectively positioning the film laterally relative to the support structure such that the selected first element is aligned with the second element.
15. The method of claim 12 , further comprising performing electrical testing on at least one of the first and second pluralities of dies to identify known good dies having properly-functioning electrical characteristics.
16. The method of claim 11 , further comprising polishing a first bonding surface of the first element and a second bonding surface of the second element with the first element on the film.
17. A method for mounting integrated device dies on a support structure, the method comprising:
receiving a plurality of singulated integrated device dies after a substrate has been singulated to define the plurality of singulated integrated device dies;
providing a film;
placing the plurality of singulated integrated device dies to be supported by the film, the plurality of singulated integrated device dies disposed adjacent one another along a surface of the film;
positioning the film adjacent the support structure such that the surface of the film faces a support surface of the support structure;
selecting a first known good die from the plurality of singulated integrated device dies, the first known good die having properly-functioning electrical characteristics;
selectively positioning the film laterally relative to the support structure such that the first known good die is aligned with a first location of the support structure;
applying a force in a direction nonparallel to the surface of the film to cause the selected first known good die to be directly transferred from the film to the support structure, such that the first known good die is removed from the film.
18. The method of claim 17 , wherein the support structure comprises an element, the method further comprising directly bonding the first known good die to the element without an intervening adhesive.
19. The method of claim 1 , wherein the film is wider than at least two singulated elements of the plurality of singulated elements.
20. The method of claim 11 , wherein the film is wider than at least two singulated elements of the plurality of singulated elements.
21. The method of claim 17 , wherein the film is wider than at least two singulated elements of the plurality of singulated elements.
22. A method for mounting a plurality of elements on a support structure, the method comprising:
receiving a plurality of singulated elements;
providing a film;
placing the plurality of singulated elements to be supported by the film, the plurality of singulated elements disposed adjacent one another along a surface of the film;
positioning the film adjacent the support structure such that the surface of the film faces a support surface of the support structure;
selectively positioning the film laterally relative to the support structure such that a selected first element is aligned with a first location of the support structure; and
applying a force in a direction nonparallel to the surface of the film to cause a selected first element to be directly transferred from the film to the support structure, such that the first element is removed from the film and directly bonded to the support structure without an intervening adhesive.
23. The method of claim 22 , wherein the support structure comprises a wafer or wafer stack, a die or die stack, a reconstituted wafer, a panel, a reconstituted panel, a printed circuit board, an interposer, a glass substrate, a plastic substrate, a ceramic substrate, or package substrate.