Probe pad with built-in interconnect structure
A system includes a wafer including at least an electronic component and a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component. The electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer. The probe pad is aligned with the wafer by using alignment marks. A prober alignment camera is employed to locate the alignment marks.
1. A system comprising:
a wafer including at least an electronic component; and
a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component, the probe pad being aligned with the wafer by using a prober alignment camera between the probe pad and the wafer to locate alignment marks.
2. The system of claim 1 , wherein the electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer.
3. The system of claim 1 , wherein the BEOL interconnect structure of the probe pad includes conductive lines and metals contacts formed within a dielectric.
4. The system of claim 1 , wherein the probe pad alignment marks are positioned on opposed ends on the probe pad.
5. The system of claim 4 , wherein the probe pad alignment marks are connected to an alignment circuit.
6. The system of claim 1 , wherein different BEOL interconnect structures can be incorporated into the probe pad to test different types of electronic components.
7. The system of claim 1 , wherein the probe pad is wafer-sized to test all chips in the wafer simultaneously.
8. The system of claim 1 , wherein the probe pad is smaller than the wafer to test a single die or multiple dies at a time.
9. The system of claim 1 , wherein the electronic component is a memory device.
10. The system of claim 1 , wherein the electronic component is a logic device.
11. A method comprising:
handling a wafer having at least an electronic component;
using a prober alignment camera between a probe pad and the wafer to locate alignment marks; and
testing the electronic component by using the probe pad including a built-in back-end-of-line (BEOL) interconnect structure.
12. The method of claim 11 , wherein the electronic component is tested by the probe pad without building full BEOL interconnect circuits on the wafer.
13. The method of claim 11 , wherein the probe pad is aligned with the wafer by using alignment marks.
14. The method of claim 11 , wherein probe pad alignment marks are positioned on opposed ends on the probe pad, the probe pad alignment marks connected to an alignment circuit.
15. The method of claim 11 , wherein the probe pad is wafer-sized to test all chips in the wafer simultaneously.
16. A system comprising:
a wafer including at least an electronic component;
a probe pad including a built-in back-end-of-line (BEOL) interconnect structure to test the electronic component;
a prober alignment camera to align prober alignment marks with wafer alignment marks; and
an alignment circuit to align the probe pad with the wafer, the alignment circuit having low resistance when the prober and the wafer are aligned.
17. The system of claim 16 , wherein the probe pad is wafer-sized to test all chips in the wafer simultaneously.
18. The system of claim 1 , wherein the camera can rotate 360°.
19. The method of claim 11 , wherein the camera can rotate 360°.
20. The system of claim 16 , wherein the camera can rotate 360°.