IP Library › Granted Patent US 11,075,228
Granted Patent B2
US 11,075,228 · App. 16/599,948 · Granted Jul 27, 2021

Display substrate, method for manufacturing the same, and display device

Inventors: Jingang Fang (Beijing, CN); Luke Ding (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L27/1244H01L27/1225H01L27/1248H01L27/1255H01L27/1259H01L29/78633H01L29/78693
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,075,228
App. No.
16/599,948
Granted
Jul 27, 2021
Kind
B2
Abstract

A display substrate, a method for manufacturing the display substrate, and a display device are provided in the present disclosure. The display substrate includes: a substrate; a first insulation layer on the substrate; a first signal line on a side of the first insulation layer distal to the substrate; a second insulation layer covering the first signal line; and a second signal line on a side of the second insulation layer distal to the substrate, the second signal line overlapping with the first signal line at an overlap region. A concave portion is formed in the first insulation layer. At least at the overlap region, the first signal line is in the concave portion.

Claims (59)

1. A display substrate, comprising:

a substrate;

a first insulation layer on the substrate;

a first signal line on a side of the first insulation layer distal to the substrate;

a second insulation layer, covering the first signal line;

a second signal line on a side of the second insulation layer distal to the substrate, the second signal line overlapping with the first signal line at an overlap region;

a metal light-shielding layer on a side of the substrate proximal to the first insulation layer and covered by the first insulation layer; and

a thin film transistor on the side of the first insulation layer distal to the substrate,

wherein

a concave portion is formed in the first insulation layer,

at least at the overlap region, the first signal line is in the concave portion, and

an orthographic projection of the thin film transistor on the metal light-shielding layer is inside the metal light-shielding layer.

2. The display substrate according to claim 1 , wherein

an extension direction of the first signal line intersects with an extension direction of the second signal line.

3. The display substrate according to claim 2 , wherein

the concave portion has a hole shape; and

a portion of the first signal line is in the hole-shaped concave portion in the overlap region.

4. The display substrate according to claim 2 , wherein

the concave portion is a long groove extending in parallel to a surface of the substrate; and

the first signal line is in the long groove.

5. The display substrate according to claim 3 , wherein

a surface, which is distal to the side of the substrate, of the first signal line in the concave portion protrudes from the concave portion.

6. The display substrate according to claim 3 , wherein

a surface, which is distal to the side of the substrate, of the first signal line in the concave portion is flush with an opening of the concave portion.

7. The display substrate according to claim 3 , wherein

a surface, which is distal to the side of the substrate, of the first signal line in the concave portion is lower than an opening of the concave portion.

8. The display substrate according to claim 6 , wherein

the first insulation layer comprises silicon organic glass.

9. The display substrate according to claim 8 , further comprising a third insulation layer between a bottom surface of the concave portion and the first signal line.

10. The display substrate according to claim 8 , further comprising a third insulation layer covering the bottom surface and sidewalls of the concave portion and extending onto a surface of the first insulation layer distal to the substrate.

11. A display device, comprising the display substrate according to claim 1 .

12. A method for manufacturing a display substrate, comprising:

forming a first insulation layer on a substrate;

forming a concave portion in the first insulation layer;

forming a first signal line on a side of the first insulation layer distal to the substrate;

forming a second insulation layer on the first signal line; and

forming a second signal line on a side of the second insulation layer distal to the substrate, the second signal line overlapping with the first signal line at an overlap region, wherein

at least at the overlap region, the first signal line is formed in the concave portion, and

the forming a first insulation layer on the substrate and forming a concave portion in the first insulation layer comprises;

coating a solution of silicon organic glass on the substrate; and

performing a pre-baking process, an exposure process, and a development process on the solution of silicon organic glass to obtain the concave portion.

13. The method according to claim 2 , wherein

an extension direction of the first signal line intersects with an extension direction of the second signal line;

the concave portion is formed in a hole shape; and

a portion of the first signal line is formed in the concave portion in the overlap region.

14. The method according to claim 13 , wherein

the first signal line is formed such that a surface, which is distal to the side of the substrate, of the first signal line in the concave portion is flush with an opening of the concave portion.

15. The method according to claim 14 , wherein between the forming a concave portion in the first insulation layer and the forming a second insulation layer, the method further comprises:

forming a third insulation layer covering the bottom surface and sidewalls of the concave portion and extending onto a surface of the first insulation layer distal to the substrate; and

forming the first signal line on the third insulation layer in the concave portion.

16. The method according to claim 14 , wherein between the forming a concave portion in the first insulation layer and the forming a second insulation layer, the method further comprises:

forming a third insulation layer on a bottom surface of the concave portion; and

forming the first signal line on the third insulation layer.

17. The method according to claim 13 , wherein

the first signal line is formed such that a surface, which is distal to the side of the substrate, of the first signal line in the concave portion protrudes from the concave portion.

18. The method according to claim 12 , wherein

an extension direction of the first signal line intersects with an extension direction of the second signal line;

the concave portion is formed as a long groove extending in parallel to a surface of the substrate; and

the first signal line is formed in the long groove.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2019
From: FANG, JINGANG; DING, LUKE
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050859/0792 →
Priority Claims (1)
CN 201811196955.3 · Oct 15, 2018 · national
Continuity (1)
Related Publication 20200119054A1 · Apr 16, 2020