IP Library Granted Patent US 11,737,253
Granted Patent B2
US 11,737,253 · App. 16/605,903 · Granted Aug 22, 2023

Uniform layouts for SRAM and register file bit cells

Inventors: Zheng Guo (Portland, OR); Clifford L. Ong (Portland, OR); Eric A. Karl (Portland, OR); Mark T. Bohr (Aloha, OR)
Assignee: Intel Corporation
H10B10/12H01L23/528H01L27/0207H01L27/0924
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,737,253
App. No.
16/605,903
Granted
Aug 22, 2023
Kind
B2
Abstract

Uniform layouts for SRAM and register file bit cells are described. In an example, an integrated circuit structure includes a six transistor (6T) static random access memory (SRAM) bit cell on a substrate. The 6T SRAM bit cell includes first and second active regions parallel along a first direction of the substrate. First, second, third and fourth gate lines are over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction.

Claims (21)

1. An integrated circuit structure, comprising:

a substrate;

a six transistor (6T) static random access memory (SRAM) bit cell on the substrate, the 6T SRAM bit cell comprising:

first and second active regions parallel along a first direction of the substrate; and

first, second, third and fourth gate lines over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction, wherein all of the first, second, third and fourth gate lines vertically overlap one of the first active region or the second active region, and wherein at least two of the first, second, third or fourth gate lines vertically overlap both of the first active region and the second active region.

2. The integrated circuit structure of claim 1 , wherein the first active region is an N-type doped active region, and the second active region is a P-type doped active region.

3. The integrated circuit structure of claim 1 , wherein the first and second active regions are in first and second silicon fins, respectively.

4. The integrated circuit structure of claim 1 , wherein all individual ones of the first, second, third and fourth gate lines are continuous between the first and second active regions.

5. The integrated circuit structure of claim 1 , wherein the 6T SRAM bit cell has a first length along the first direction and a second length along the second direction, and the first length is greater than the second length.

6. The integrated circuit structure of claim 1 , wherein individual ones of the first, second, third and fourth gate lines are spaced apart from one another by trench contact lines parallel along the second direction of the substrate.

7. An integrated circuit structure, comprising:

a substrate;

a six transistor (6T) static random access memory (SRAM) bit cell on the substrate, the 6T SRAM bit cell comprising:

first and second active regions parallel along a first direction of the substrate, wherein the first active region is an N-type doped active region, and the second active region is a P-type doped active region; and

first, second, third and fourth gate lines over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction, wherein all of the first, second, third and fourth gate lines vertically overlap one of the first active region or the second active region.

8. An integrated circuit structure, comprising:

a substrate;

a six transistor (6T) static random access memory (SRAM) bit cell on the substrate, the 6T SRAM bit cell comprising:

first and second active regions parallel along a first direction of the substrate;

and first, second, third and fourth gate lines over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction, wherein all of the first, second, third and fourth gate lines vertically overlap one of the first active region or the second active region;

wherein each of the first, second, third, and fourth gate lines vertically overlap the first active region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2023
From: GUO, ZHENG; ONG, CLIFFORD L.; KARL, ERIC A.; BOHR, MARK T.
To: INTEL CORPORATION
Reel/Frame 064063/0339 →
Continuity (1)
Related Publication 20200058656A1 · Feb 20, 2020
Cited By (1)
US 12,501,645