Production of a chip module

1. A method of producing a chip module comprising:

providing a carrier;

arranging semiconductor chips on the carrier;

applying an electrically insulating material on the carrier; and

structuring the carrier such that the chip module is provided,

wherein the chip module comprises separate carrier sections produced by structuring the carrier, the carrier sections of the chip module connected by the electrically insulating material, structuring the carrier comprises forming trenches,

forming the trenches is carried out such that the trenches are present at a back side of the provided chip module and the trenches extend to the electrically insulating material such that the electrically insulating material is visible at the back side of the provided chip module via the trenches,

applying the electrically insulating material on the carrier is carried out after arranging the semiconductor chips on the carrier,

structuring the carrier including forming the trenches is carried out after applying the electrically insulating material on the carrier, and

forming the trenches comprises severing the carrier only in areas of the trenches to be formed.

2. The method according to claim 1 , wherein the method further comprises at least one of:

1) the semiconductor chips are radiation-emitting semiconductor chips,

2) the electrically insulating material is applied on the carrier in the form of a structure comprising a plurality of lens,

3) the semiconductor chips comprise some semiconductor chips configured to generate a first light radiation, other semiconductor chips configured to generate a second light radiation and still other semiconductor chips configured to generate a third light radiation, and

4) the electrically insulating material is a flexible material.

3. The method according to claim 1 , wherein the provided carrier comprises an electrically insulating carrier material and electrical conductor structures.

4. The method according to claim 1 , wherein the provided carrier comprises a metallic leadframe and a molding compound connected to the metallic leadframe,

the metallic leadframe comprises metallic leadframe sections and metallic connection structures connecting the metallic leadframe sections,

structuring the carrier comprises severing metallic connection structures of the metallic leadframe, and

metallic connection structures of the metallic leadframe are severed by forming the trenches.

5. The method according to claim 4 ,

wherein the carrier comprises molded bodies formed from the molding compound, each molded body enclosing a cavity,

the semiconductor chips are arranged on the metallic leadframe in the cavities of the molded bodies, and

the electrically insulating material is applied on the carrier in areas laterally to and between the molded bodies.

6. The method according to claim 1 , wherein the provided carrier is one of:

a printed circuit board;

a ceramic carrier comprising electrical conductor structures; or

a metallic leadframe.

7. The method according to claim 1 , wherein the provided chip module is singulated into smaller chip modules by only severing the electrically insulating material.

8. The method according to claim 1 , wherein structuring the carrier additionally comprises removing a part of the electrically insulating material.

9. The method according to claim 1 , wherein applying the electrically insulating material on the carrier is carried out by filling, potting or molding.

10. A method of producing a chip module comprising:

providing a carrier;

arranging semiconductor chips on the carrier;

applying an electrically insulating material on the carrier; and

structuring the carrier such that the chip module is provided,

wherein the chip module comprises separate carrier sections produced by structuring the carrier, the carrier sections of the chip module connected by the electrically insulating material,

the provided carrier comprises a metallic leadframe, a molding compound connected to the metallic leadframe and molded bodies formed from the molding compound and connected to each other by the molding compound, each molded body enclosing a cavity,

the semiconductor chips are arranged on the metallic leadframe in the cavities of the molded bodies, and

the electrically insulating material is applied on the carrier in areas laterally to and between the molded bodies.

11. The method according to claim 1 , wherein the trenches are formed as a continuous grid structure.

12. The method according to claim 10 , wherein a group of three radiation-emitting semiconductor chips is arranged in each cavity of the molded bodies, the group comprising a first semiconductor chip configured to generate a red light radiation, a second semiconductor chip configured to generate a green light radiation and a third semiconductor chip configured to generate a blue light radiation.

13. The method according to claim 1 , wherein structuring the carrier is carried out by a mechanical process, the mechanical process being one of sawing, cutting or laser cutting.

14. A method of producing a chip module comprising:

providing a carrier;

arranging semiconductor chips on the carrier;

applying an electrically insulating material on the carrier; and

structuring the carrier such that the chip module is provided,

wherein the chip module comprises separate carrier sections produced by structuring the carrier, the carrier sections of the chip module connected by the electrically insulating material,

structuring the carrier comprises forming trenches,

forming the trenches is carried out such that the trenches are present at a back side of the provided chip module and the trenches extend to the electrically insulting material such that the electrically insulating material is visible at the back side of the provided chip module via the trenches, and the method further comprises at least one of:

1) structuring the carrier additionally comprises removing a part of the electrically insulting material, and

2) the provided carrier comprises a metallic leadframe and a molding compound connected to the metallic leadframe, the metallic leadframe comprises metallic leadframe sections and metallic connection structures connecting the metallic leadframe sections, structuring the carrier comprises severing metallic connection structures of the metallic leadframe, and metallic connection structures of the metallic leadframe are severed by forming the trenches.