IP Library › Granted Patent US 10,982,115
Granted Patent B2
US 10,982,115 · App. 16/607,692 · Granted Apr 20, 2021

Adhesive composition

Inventors: Masaru Andou (Nagoya, JP); Yuushi Andou (Takaoka, JP); Akitsugu Shibata (Nagoya, JP); Michihiro Kaai (Nagoya, JP)
Assignee: TOAGOSEI CO., LTD.
C09J4/06C09J133/20
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Quick Facts
Patent No.
US 10,982,115
App. No.
16/607,692
Granted
Apr 20, 2021
Kind
B2
Abstract

An adhesive composition according to the present invention contains a polymerizable monomer (A) and a block copolymer (B) including a polymer block (a) which includes structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b), in which the polymer block (a) and the acrylic polymer block (b) have a solubility parameter of 10.0 or more and 9.0 or more, respectively; the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a); the polymer block (a) has a glass transition temperature of 150° C. or higher; and the polymer block (b) has a glass transition temperature of 20° C. or lower.

Claims (17)

1. An adhesive composition, containing:

a polymerizable monomer (A), and

a block copolymer (B) including a polymer block (a) which comprises structural units derived from a styrene compound and from a maleimide compound, and an acrylic polymer block (b),

wherein the solubility parameter of the polymer block (a) is 10.0 or more;

the solubility parameter of the acrylic polymer block (b) is 9.0 or more;

the polymer block (a) contains the structural unit derived from a maleimide compound at a concentration from 30% by mass to 99% by mass with respect to the total mass of the polymer block (a);

the polymer block (a) has a glass transition temperature of 150° C. or higher; and

the polymer block (b) has a glass transition temperature of 20° C. or lower,

wherein the content of the block copolymer (B) is from 1 part by mass to 100 parts by mass relative to 100 parts by mass of the polymerizable monomer (A).

2. The adhesive composition according to claim 1 , wherein the polymer block (a) contains the structural unit derived from a styrene compound at a concentration from 1% by mass to 70% by mass with respect to the total mass of the polymer block (a).

3. The adhesive composition according to claim 1 , wherein the structural unit derived from a maleimide compound is a structural unit represented by the following Formula (1):

wherein, in Formula (1), R 1 represents hydrogen, an alkyl group having 1 to 3 carbon atoms, or -Ph-R 2 ; Ph represents phenylene group; and R 2 represents hydrogen, an alkyl group having 1 to 3 carbon atoms, hydroxy group, an alkoxy group having 1 or 2 carbon atoms, acetyl group, or halogen.

4. The adhesive composition according to claim 1 , wherein the polymer block (a) comprises a structural unit derived from a vinyl compound having an amide group(s).

5. The adhesive composition according to claim 1 , wherein the number-average molecular weight of the block copolymer (B) is from 10,000 to 500,000.

6. The adhesive composition according to claim 1 , wherein the polymerizable monomer (A) is an ethylenically unsaturated compound.

7. The adhesive composition according to claim 1 , wherein the polymerizable monomer (A) is at least one monomer selected from the group consisting of (meth)acrylate compounds and cyanoacrylate compounds.

8. The adhesive composition according to claim 1 , which is an adhesive composition for bonding vehicle components.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: ANDOU, MASARU; ANDOU, YUUSHI; SHIBATA, AKITSUGU; KAAI, MICHIHIRO
To: TOAGOSEI CO., LTD.
Reel/Frame 050966/0460 →
Priority Claims (1)
JP JP2017-087410 · Apr 26, 2017 · national
Continuity (1)
Related Publication 20200048499A1 · Feb 13, 2020