Method of depositing nanotwinned nickel-molybdenum-tungsten alloys
The present invention is directed to the synthesis of metallic nickel-molybdenum-tungsten films and coatings with direct current sputter deposition, which results in fully-dense crystallographically textured films that are filled with nano-scale faults and twins. The as-deposited films exhibit linear-elastic mechanical behavior and tensile strengths above 2.5 GPa, which is unprecedented for materials that are compatible with wafer-level device fabrication processes. The ultra-high strength is attributed to a combination of solid solution strengthening and the presence of the dense nano-scale faults and twins. These films also possess excellent thermal and mechanical stability, high density, low CTE, and electrical properties that are attractive for next generation metal MEMS applications. Deposited as coatings these films provide protection against friction and wear. The as-deposited films can also be heat treated to modify the internal microstructure and attendant mechanical properties in a way that provides a desired balance of strength and toughness.
1. A film comprising:
an alloy of nickel (Ni), molybdenum (Mo), tungsten (W) (Ni—Mo—W) having very high predetermined tensile strength, thermal and mechanical stability of predetermined levels, predetermined high density, predetermined low CTE, predetermined electrical properties that are similar to the bulk alloy, and a structure of nano-scale stacking faults and twins lying in a plane of the film;
wherein the alloy is deposited as a coating or freestanding thin film or device; and,
wherein the alloy comprises a crystallographic structure possessing a predetermined strong <111> crystallographic texture and a predetermined high density of nano-scale planar defects (stacking faults and twins) oriented in the plane of the film.
2. The film of claim 1 wherein the deposition of the alloy is achieved with direct current sputter deposition.
3. The film of claim 1 further comprising a tensile strength of above 2.5 GPa.
4. The film of claim 1 that is microstructurally stable and does not coarsen when exposed to stresses as high as 3.4 GPa or temperatures as high at 600° C.
5. The film of claim 1 further comprising a coefficient of thermal expansion that is lower than that for pure Ni.
6. The film of claim 1 further comprising an electrical conductivity that is similar to the alloy in bulk coarse-grained form.
7. The film of claim 1 may also be deposited as a protective coating whose mechanical strength, stability and hardness provide tribological protection against friction and wear.
8. The film of claim 1 may also be heat treated to modify the mechanical properties in a way that provides a desired balance of strength and toughness, for example, thermal annealing for 1 hour at 1,000° C. results in films with 1.2 GPa tensile strength and 9% tensile ductility.
9. The film of claim 1 further comprising an electrical conductivity that is similar to the alloy in bulk coarse-grained form.
10. The film of claim 1 may also be deposited as a protective coating whose mechanical strength, stability and hardness provide tribological protection against friction and wear.
11. The film of claim 1 may also be heat treated to modify the mechanical properties in a way that provides a desired balance of strength and toughness, for example, thermal annealing for 1 hour at 1,000° C. results in films with 1.2 GPa tensile strength and 9% tensile ductility.
12. A film comprising:
an alloy of nickel (Ni), molybdenum (Mo), tungsten (W) (Ni—Mo—W) having very high predetermined tensile strength, thermal and mechanical stability of predetermined levels, predetermined high density, predetermined low CTE, predetermined electrical properties that are similar to the bulk alloy, and a structure of nano-scale stacking faults and twins lying in a plane of the film;
wherein the alloy is deposited as a coating or freestanding thin film or device; and,
wherein the alloy is microstructurally stable and does not coarsen when exposed to stresses as high as 3.4 GPa or temperatures as high at 600° C.
13. The film of claim 12 wherein the deposition of the alloy is achieved with direct current sputter deposition.
14. The film of claim 12 further comprising a crystallographic structure possessing a predetermined strong <111> crystallographic texture and a predetermined high density of nano-scale planar defects (stacking faults and twins) oriented in the plane of the film.
15. The film of claim 12 further comprising a tensile strength of above 2.5 GPa.
16. The film of claim 12 further comprising a coefficient of thermal expansion that is lower than that for pure Ni.