MEMS microphone and a manufacturing method thereof
A MEMS microphone and a manufacturing method thereof are provided. The MEMS microphone comprises a MEMS microphone chip and a housing with an acoustic port. The MEMS microphone chip is mounted in the housing, and a mesh plug is mounted in the acoustic port and made from a mesh material which has a mesh structure that is suitable for passage of sound.
1. A MEMS microphone, comprising:
a MEMS microphone chip;
a housing, which has an acoustic port, and
a mesh plug,
wherein the MEMS microphone chip is mounted in the housing, and the mesh plug is mounted in the acoustic port,
wherein the mesh plug is made from a mesh material which has a mesh structure adapted for passing sound pressure to the MEMS microphone chip, and
wherein the mesh plug has a step structure so that a first part of the mesh plug is inside the acoustic port and a second part of the mesh plug is outside the acoustic port.
2. The MEMS microphone according to claim 1 , further comprising yin ASIC chip, wherein the housing includes a package substrate and a lid, the MEMS microphone chip and the ASIC chip are mounted on the package substrate, avid the acoustic port is in the package substrate.
3. The MEMS microphone according to claim 1 , wherein the acoustic port has a tapper-shape.
4. The MEMS microphone according to claim 1 wherein the mesh plug is adhered to a side wall of the acoustic port.
5. The MEMS microphone according to claim 1 , wherein the mesh plug is made of at least one of porous structures, nano-structures, fabric mesh and woven mesh.
6. The MEMS microphone according to claim 1 , wherein the mesh material of the mesh plug includes at least one of a polymer, foam plastic, silicon, silicide, ceramic, metal, alloy, paper, wood and glass.
7. A method for manufacturing a MEMS microphone; comprising:
mounting a mesh layer on a carrier substrate;
machining the mesh layer into a mesh plug;
forming an acoustic port on a housing of the MEMS microphone;
dispensing adhesive into the acoustic port;
assembling the mesh plug into the acoustic port;
releasing the carrier substrate; and
mounting a MEMS microphone chip and an ASIC chip in the housing,
wherein the mesh plug is machined into a step structure so that the mesh plug is assembled into the acoustic port with a first part inside the acoustic port and a second part outside the acoustic port.
8. The method according to claim 7 , wherein said second part outside the acoustic port is removed during releasing the carrier substrate.