IP Library Granted Patent US 11,385,265
Granted Patent B2
US 11,385,265 · App. 16/619,334 · Granted Jul 12, 2022

Current sensing device

Inventors: Seungjin Ham (Anyang-si, KR); Jinyoung Park (Anyang-si, KR); Jongmahn Sohn (Anyang-si, KR)
Assignee: LS ELECTRIC CO., LTD.
G01R15/186G01R15/185G01R19/25H05K1/165H01F27/427H01F38/30H01F38/32H01F2038/305H05K2201/086H05K2201/09027
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Quick Facts
Patent No.
US 11,385,265
App. No.
16/619,334
Granted
Jul 12, 2022
Kind
B2
Abstract

A current sensing device according to the present invention may comprise: a substrate part which includes at least two base substrates stacked in one direction and through which a circuit passes in the one direction; a coil part which is formed on at least one of the base substrates and surrounds the circuit; and a core part which is disposed between the base substrates while being spaced apart from the coil part, and surrounds the circuit.

Claims (36)

1. A current sensing device for sensing a current flowing on a circuit, comprising:

a current sensor unit; and

a controller;

wherein the current sensor unit comprises:

a power source unit, and

a core and PCB coil assembly;

wherein a circuit passes through the power source unit and the core and PCB coil assembly in one direction;

wherein a primary current flows through the circuit, causing a first magnetic field to be applied to the power source unit and the core and PCB coil assembly;

wherein the power source unit generates a source current from the first magnetic field, thereby supplying the source current to the controller;

wherein the core and PCB coil assembly generates a secondary current by a voltage induced from the first magnetic field;

wherein the core and PCB coil assembly includes a first assembly and a second assembly,

wherein the first assembly generates a second magnetic field, based on the source current applied from the controller;

wherein the second assembly generates the secondary current, based on a current induced by the rest of the first magnetic field and a compensation current applied from the controller;

wherein the controller calculates an amount of the primary current flowing through the circuit, based on the secondary current;

wherein the controller comprises:

a compensation unit to apply a compensation current to the first assembly;

a signal processing unit to convert an analog voltage signal as the output voltage provided from the second assembly, into a digital signal; and

a calculation unit to calculate the amount of a primary current flowing on the circuit, based on the digital signal, the voltage signal;

wherein the core and PCB coil assembly includes a substrate part, a coil part, and a core part;

wherein the substrate part comprises a first base substrate, second base substrates mounted to both side surfaces of the first base substrate, and third base substrates mounted to the second base substrates, respectively;

wherein the coil part comprises a first coil part and a second coil part;

wherein the first coil part is provided in the first assembly, and the second coil part is provided in the second assembly; and

wherein the core part is inserted into an inner region of the substrate part.

2. The current sensing device of claim 1 , further comprising:

an oscillation unit configured to apply the source current for driving the first coil part.

3. The current sensing device of claim 1 , wherein the substrate part includes:

a first substrate part where the first coil part is formed; and

a second substrate part stacked on the first substrate part, and where the second coil part is formed.

4. The current sensing device of claim 3 ,

wherein the first core part inserted into the first substrate part; and

the second core part inserted into the second substrate part.

5. The current sensing device of claim 3 , wherein the core part is arranged between the first substrate part and the second substrate part.

6. The current sensing device of claim 1 , wherein the coil part includes:

a plurality of conductive pad portions formed on at least two of surfaces of the base substrates defined to be perpendicular to the one direction; and

a plurality of connection portions configured to connect the conductive pad portions to each other, by passing through at least one of the base substrates in the one direction.

7. The current sensing device of claim 6 , wherein the core part is arranged to correspond to an inner region of the conductive pad portions, between both ends of each of the conductive pad portions.

Assignments (2)
CHANGE OF NAME Recorded Jun 8, 2022
From: LSIS CO., LTD.
To: LS ELECTRIC CO., LTD.
Reel/Frame 060312/0496 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2019
From: PARK, JINYOUNG; SOHN, JONGMAHN; HAM, SEUNGJIN
To: LSIS CO., LTD.
Reel/Frame 051378/0842 →
Priority Claims (1)
KR 10-2017-0072711 · Jun 9, 2017 · national
Continuity (1)
Related Publication 20200116762A1 · Apr 16, 2020