Deposition apparatus having particular arrangement of raw material supply port, partition plate, and opening for measuring a temperature

1. A deposition apparatus comprising:

a reaction space which is a reaction chamber;

a front chamber for deposition;

a raw material supply port that is configured to supply a raw material to the reaction space;

an opening for measuring a temperature of a wafer mounted on a wafer mounting surface of a mounting stage disposed in the reaction space; and

a partition plate that partitions the reaction space and the front chamber for deposition,

wherein the raw material supply port is positioned on the same plane as the partition plate or on the reaction space side from the partition plate,

the opening is positioned on the front chamber for deposition side from the partition plate, and the opening is one end of a pipe for a pyrometer on the reaction space side, and

in a vertical direction from the opening to the wafer mounting surface, a distance between the opening and a surface of the partition plate on the reaction space side is 20% or more of a diameter of the opening,

wherein the deposition apparatus is configured with one opening in the partition plate for supplying raw material to the reaction space, and

wherein the deposition apparatus does not include a shower plate.

2. The deposition apparatus according to claim 1 ,

wherein the front chamber for deposition is separated into a first area to which a source gas is supplied and a second area in which the opening is present.

3. The deposition apparatus according to claim 1 , further comprising:

a purge gas supply port between the opening and the raw material supply port,

wherein a flow direction of a purge gas which is supplied from the purge gas supply port to the reaction space intersects a line connecting the opening and the raw material supply port.

4. The deposition apparatus according to claim 1 , further comprising:

a purge gas supply element for supplying a purge gas from the opening to the reaction space.

5. The deposition apparatus according to claim 1 ,

wherein the raw material supply port is one end of a raw material supply pipe, and

a source gas is separated from other spaces up to the raw material supply port.

6. The deposition apparatus according to claim 1 , further comprising:

a radiation pyrometer for measuring a temperature of a wafer.

7. The deposition apparatus according to claim 1 , further comprising:

a raw material supply pipe,

wherein the raw material supply port is provided at a distal end of the raw material supply pipe.

8. The deposition apparatus according to claim 1 ,

wherein the front chamber for deposition includes a first area to which a source gas is supplied and a second area inside of which a pyrometer port is provided, which are divided by a front chamber partition plate, and

the raw material supply port is provided in the partition plate that partitions the first area and the front chamber for deposition.

9. The deposition apparatus according to claim 1 , further comprising:

a pipe for a pyrometer,

wherein the opening for measuring the temperature of the wafer is provided at a distal end of the pipe for a pyrometer.

10. The deposition apparatus according to claim 1 ,

wherein a source gas as a raw material is supplied to the wafer to perform film deposition.

11. The deposition apparatus according to claim 1 ,

wherein the pipe for a pyrometer is located in the front chamber for deposition.

12. The deposition apparatus according to claim 1 ,

wherein a part of the pipe for a pyrometer protrudes outside of the front chamber.

13. The deposition apparatus according to claim 1 ,

wherein the distance between the opening and the surface of the partition plate on the reaction space side is 500% or less of the diameter of the opening.

14. The deposition apparatus according to claim 1 ,

wherein the raw material supply port is positioned on the reaction space side from the partition plate.