Component manufacturing device and component manufacturing method
In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatus 1 includes a chucking and fixing means 20 that chucks and fixes a component holding film to a heated chucking surface 21 a , and a preventing means 30 that prevents heat convection, occurring on the chucking surface 21 a , from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface 21 a , and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface 21 a , from contacting the film.
1. A component manufacturing apparatus comprising a chucking and fixing means that chucks and fixes a component holding film to a heated surface of a chuck table, wherein
a component to be held to the film is a component selected from the group consisting of a semiconductor component, a precursor of the semiconductor component, an electronic component, and a precursor of the electronic component, and
the apparatus comprises a preventing means that prevents heat convection, occurring on the surface of the chuck table, from contacting the film to which the component is held,
wherein the preventing means is a means that interposes a blocking member between the surface of the chuck table and the film,
wherein the apparatus comprises a transport means, and the transport means is a means that lowers the film toward the surface of the chuck table, or a means that raises the surface of the chuck table toward the film so as to bring the film and the surface of the chuck table into contact with each other.
2. The component manufacturing apparatus according to claim 1 , wherein the chucking and fixing means has a chuck table that has a flat chucking surface, and
the chucking surface includes chucking holes and/or chucking grooves that are connected to a chucking source for chucking.
3. The component manufacturing apparatus according to claim 1 , wherein the blocking member has a single plate or a plurality of plates that can cover the chucking surface.
4. The component manufacturing apparatus according to claim 1 , wherein the transport means is a means that lowers the film maintained horizontally toward the surface of the chuck table, or a means that raises the surface of the chuck table toward the film maintained horizontally.
5. A component manufacturing apparatus comprising a chucking and fixing means that chucks and fixes a component holding film to a heated surface of a chuck table, wherein
a component to be held to the film is a component selected from the group consisting of a semiconductor component, a precursor of the semiconductor component, an electronic component, and a precursor of the electronic component, and
the apparatus comprises a preventing means that prevents heat convection, occurring on the surface of the chuck table, from contacting the film to which the component is held,
wherein the preventing means is a means that blows gas,
wherein the apparatus comprises a transport means, and the transport means is a means that lowers the film toward the surface of the chuck table, or a means that raises the surface of the chuck table toward the film so as to bring the film and the surface of the chuck table into contact with each other.
6. The component manufacturing apparatus according to claim 5 , wherein the chucking and fixing means has a chuck table that has a flat chucking surface, and
the chucking surface includes chucking holes and/or chucking grooves that are connected to a chucking source for chucking.
7. The component manufacturing apparatus according to claim 5 , wherein the gas blowing means has a wind forming part that forms the wind and a guide path.
8. A component manufacturing method comprising a setting step of chucking and fixing a component holding film to a heated surface of a chuck table, wherein
a component to be held to the film is a component selected from the group consisting of a semiconductor component, a precursor of the semiconductor component, an electronic component, and a precursor of the electronic component, and
the setting step includes a preventing step of preventing heat convection, occurring on the surface of the chuck table, from contacting the film to which the component is held,
wherein the preventing step is a step of interposing a blocking member between the surface of the chuck table and the component holding film,
wherein the setting step includes a transport step, and the transport step is a step of lowering the film toward the surface of the chuck table, or a step of raising the surface of the chuck table toward the film so as to bring the film and the surface of the chuck table into contact with each other.
9. The component manufacturing method according to claim 8 , wherein
the film includes a holding layer that holds the component and a base layer that supports the holding layer, and
a linear thermal expansion coefficient of the base layer is 100 ppm/K or more.
10. The component manufacturing method according to claim 8 , wherein a ratio R E1 (=E′(160)/E′(25)) of an elastic modulus at 160° C. of the base layer to an elastic modulus at 25° C. of the base layer is 0.2 or less, and E′(25) is 400 MPa or less.
11. A component manufacturing method comprising a setting step of chucking and fixing a component holding film to a heated surface of a chuck table, wherein
a component to be held to the film is a component selected from the group consisting of a semiconductor component, a precursor of the semiconductor component, an electronic component, and a precursor of the electronic component, and
the setting step includes a preventing step of preventing heat convection, occurring on the surface of the chuck table, from contacting the film to which the component is held,
wherein the preventing step is a step of blowing gas,
wherein the setting step includes a transport step, and the transport step is a step of lowering the film toward the surface of the chuck table, or a step of raising the surface of the chuck table toward the film so as to bring the film and the surface of the chuck table into contact with each other.
12. The component manufacturing method according to claim 11 , wherein
the film includes a holding layer that holds the component and a base layer that supports the holding layer, and
a linear thermal expansion coefficient of the base layer is 100 ppm/K or more.
13. The component manufacturing method according to claim 11 , wherein a ratio R E1 (=E′(160)/E′(25)) of an elastic modulus at 160° C. of the base layer to an elastic modulus at 25° C. of the base layer is 0.2 or less, and E′(25) is 400 MPa or less.