2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates
The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.
1. A method for creating a system-in-package with integrated lumped element devices formed in or on photodefinable glass comprising the steps of:
masking a design layout comprising one or more structures to form one or more electrical components on or in a photodefinable glass substrate;
exposing at least one portion of the photodefinable glass substrate to an activating energy source;
heating the photodefinable glass substrate for at least ten minutes above a glass transition temperature thereof;
cooling the photodefinable glass substrate to transform at least a part of the exposed glass to a crystalline material to form a glass-crystalline substrate;
etching the glass-crystalline substrate with an etchant solution to form one or more channels in the glass-crystalline substrate, wherein the glass-crystalline substrate is adjacent to the one or more channels; and
depositing, growing, or selectively etching to create a seed layer on a surface of the glass-crystalline substrate exposed during the etching step to enable electroplating of copper to fill the one or more channels and deposit on the surface of the photodefinable glass,
wherein the integrated lumped element devices reduce parasitic noise and losses by at least 25% compared to an equivalent surface mounted device that is not in or on photodefinable glass.
2. The method of claim 1 , further comprising forming an isolator in the system-in-package.
3. The method of claim 1 , further comprising forming a circulator in the system-in-package.
4. The method of claim 1 , further comprising forming an RF filter in the system-in-package.
5. The method of claim 4 , wherein the RF filter is a low-pass filter, a high-pass filter, a notch filter, or a band-pass filter.
6. The method of claim 1 , further comprising forming a power combiner or a power splitter in the system-in-package.
7. The method of claim 1 , wherein the system-in-package eliminates at least 30% of an RF parasitic signal when compared to the equivalent surface mounted device.
8. The method of claim 1 , wherein the system-in-package eliminates at least 35% of an RF parasitic signal when compared to the equivalent surface mounted device.
9. The method of claim 1 , antennas, impedance matching elements, 50 -ohm termination elements, integrated ground planes, RF shielding elements, EMI shielding elements, RF combiners, RF splitters, transformers, switches, or diplexers.
10. The system-in-package created by the method of claim 1 .
11. The system-in-package of claim 10 , wherein the system-in-package comprises an isolator.
12. The system-in-package of claim 10 , wherein the system-in-package comprises a circulator.
13. The system-in-package of claim 10 , wherein the system-in-package comprises an RF filter.
14. The system-in-package of claim 13 , wherein the RF filter is a low-pass filter, a high-pass filter, a notch filter, or a band-pass filter.
15. The system-in-package of claim 10 , wherein the system-in-package of claim 10 , wherein the system-in-package is a power combiner or a power splitter.
16. The system-in-package of claim 10 , wherein the system-in-package is an RF circuit that eliminates at least 30% of an RF parasitic signal loss when compared to the equivalent surface mounted device.
17. The system-in-package of claim 10 , wherein the system-in-package is an RF circuit that eliminates at least 35% of an RF parasitic signal loss when compared to the equivalent surface mounted device.
18. The system-in-package of claim 10 , wherein the system-in-package is an RF circuit that eliminates at least 50% of an RF parasitic signal loss when compared to the equivalent surface mounted device.
19. The system-in-package of claim 10 , wherein the system-in-package comprises one or more antennas, impedance matching elements, 50-ohm termination elements, integrated ground planes, RF shielding elements, EMI shielding elements, RF combiners, RF splitters, transformers, switches, or diplexers.
20. The method of claim 1 , wherein the system-in-package eliminates at least 50% of an RF parasitic signal when compared to the equivalent surface mounted device.
21. The method of claim 1 , further comprising converting the glass-crystalline substrate adjacent to the one or more channels to a ceramic phase.
22. A method for creating a system-in-package system in a package with integrated lumped element devices formed in or on photodefinable glass comprising the steps of:
masking a design layout comprising one or more structures to form one or more electrical components on or in a photodefinable glass substrate;
transforming at least a part of the exposed glass to a crystalline material to form a glass-crystalline substrate;
etching the glass-crystalline substrate with an etchant solution to form one or more channels in the glass-crystalline substrate, wherein the glass-crystalline substrate is adjacent to the one or more channels; and
depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate exposed during the etching step to enable electroplating of copper to fill the one or more channels and deposit on the surface of the photodefinable glass,
wherein the integrated lumped element devices reduce parasitic noise and losses by at least 25% compared to an equivalent surface mounted device that is not in or on photodefinable glass.
23. The method of claim 22 , further comprising forming an RF filter in the system-in-package.
24. The method of claim 23 , wherein the RF filter is a low-pass filter, a high-pass filter, a notch filter, or a band-pass filter.
25. The method of claim 22 , further comprising forming a power combiner or a power splitter in the system-in-package.
26. The method of claim 22 , wherein the system-in-package eliminates at least 30% of an RF parasitic signal when compared to the equivalent surface mounted device.
27. The method of claim 22 , wherein the system-in-package eliminates at least 35% of an RF parasitic signal when compared to the equivalent surface mounted device.
28. The method of claim 22 , wherein the system-in-package eliminates at least 50% of an RF parasitic signal when compared to the equivalent surface mounted device.
29. The method of claim 22 , further comprising forming one or more antennas, impedance matching elements, 50-ohm termination elements, integrated ground planes, RF shielding elements, EMI shielding elements, RF combiners, RF splitters, transformers, switches, or diplexers.
30. The method of claim 22 , further comprising forming an isolator in the system-in-package.
31. The method of claim 22 , further comprising forming a circulator in the system-in-package.
32. The method of claim 22 , further comprising converting the glass-crystalline substrate adjacent to the one or more channels to a ceramic phase.