OLED on silicon product with separated central control board
A organic light-emitting diode (OLED) on Silicon product includes a circuit board, a central control board and an OLED on Silicon display panel located on the circuit board. A core control module and a timing control module are integrated in the central control board. The OLED on Silicon display panel has a display region, a gate row driving region, a source signal driving region, and a bonding region. OLED display pixels are provided in the display region. A gate row driving circuit is integrated in the gate row driving region. A source signal driving circuit is integrated in the source signal driving region. The bonding region is a region where the OLED on Silicon display panel is bound to the central control board. The OLED on Silicon product simplifies the processing process, reduces the cost and overall size of the product, and increases the area proportion of the display region.
1. An OLED on Silicon product, comprising:
a circuit board; and
a central control board and an OLED on Silicon display panel that are located on a same surface of the circuit board,
wherein a core control module and a timing control module are integrated in the central control board,
the OLED on Silicon display panel has a display region, a gate row driving region, a source signal driving region, and a bonding region,
OLED display pixels are provided in the display region,
a gate row driving circuit is integrated in the gate row driving region,
a source signal driving circuit is integrated in the source signal driving region,
the bonding region is a region where the OLED on Silicon display panel is bound to the central control board, and
the bonding region is located on an external side of the source signal driving region close to the central control board.
2. The OLED on Silicon product according to claim 1 , wherein the gate row driving region is located on two sides of the OLED display pixels in the display region, and the source signal driving region is located on a side of the display region close to the central control board.
3. The OLED on Silicon product according to claim 1 , wherein the source signal driving circuit comprises an interface module, a line buffer module, a level shifter module, a digital-to-analog converter module, and an analog buffer module that are connected in a sequence.
4. The OLED on Silicon product according to claim 3 , wherein the line buffer module comprises a shift register module and a latch module, the latch module comprises a sampling module and a memory module, and a device of the latch module is a low voltage device.
5. The OLED on Silicon product according to claim 3 , wherein the source signal driving circuit further comprises a reference voltage module.
6. The OLED on Silicon product according to claim 3 , wherein a device of the digital-to-analog converter module is a medium voltage device.
7. The OLED on Silicon product according to claim 3 , wherein the digital-to-analog converter module is a ramp digital-to-analog converter or a resistive digital-to-analog converter.
8. The OLED on Silicon product according to claim 3 , wherein an interface in the interface module is an LVDS interface, an MIPI interface, or an eDP interface.
9. The OLED on Silicon product according to claim 1 , wherein the central control board further comprises an interface module, an oscillator module, a one-time programming module, and a static random access memory module.
10. The OLED on Silicon product according to claim 1 , wherein the OLED on Silicon product is a micro display product.
11. The OLED on Silicon product according to claim 1 , wherein the central control board is fixed to the surface of the circuit board by means of adhering.
12. The OLED on Silicon product according to claim 1 , wherein the bonding region is located between the source signal driving region and the central control board.