Dual-use strain sensor to detect environmental information
By combining at least two strain sensors in a symmetric configuration, a dual use sensor may be realized. This may reduce the footprint, cost, and complexity of employing two different sensors. It may also improve the accuracy of the measurements as two different parameters i.e., strain and environmental information are measured at the same physical location. This dual use sensor may be deployed in an array over a large area or space, providing systemic information of the subject that is previously difficult to detect.
1. A dual use sensing structure for detecting strain and temperature comprising:
a sensing plate having first and second opposing sides,
a first strain sensor deposited on the first side of the sensing plate, and
a second strain sensor deposited on the second side of the sensing plate,
wherein at least one of the first and second strain sensors comprises a conductive filler comprising a nanocomposite that tunes thermal coefficient of resistance, thereby enabling said first and second sensors when electrically connected to external readout circuit to indicate both strain and temperature.
2. The sensing structure of claim 1 wherein the first and second strain sensors each comprise piezo-resistive material including said conductive filler comprising the nanocomposite.
3. The sensing structure of claim 2 wherein said piezo-resistive material comprises composite material comprising at least one polymer binder and at least one conductive filler.
4. The sensing structure of claim 1 wherein the external readout circuit determines changes in resistance of the first and second strain sensors and derives temperature change from the determined changes in resistance.
5. The sensing structure of claim 4 wherein the thermal coefficient of resistance is tuned so that response due to effect of the thermal coefficient of resistance dominates.
6. The sensing structure of claim 1 wherein the first and second strain sensors are structured to have the same tuned thermal coefficient of resistance.
7. The sensing structure of claim 1 wherein the external readout circuit comprises a bridge to produce a strain measurement signal and an amplifier to produce a temperature indication signal that is separate from the strain measurement signal.
8. The sensing structure of claim 7 wherein the external readout circuit further comprises a switch configured to switch the first and second strain sensors between being connected to the bridge and being connected to the amplifier.
9. The sensing structure of claim 1 wherein resistivity of the nancomposite changes with humidity.
10. The sensing structure of claim 1 wherein the first and second strain sensors are arranged on the sensing plate in a rosette pattern.
11. The sensing structure of claim 1 wherein the first and second strain sensors are identical in size and thickness.
12. The sensing structure of claim 1 wherein the sensing structure is configured to be wearable.
13. The sensing structure of claim 1 wherein the sensing structure is configured to detect heat of a finger.
14. The sensing structure of claim 1 wherein the first and second sensors are bonded to the sensor plate.
15. The sensing structure of claim 1 wherein the sensing structure is encapsulated in a soft protection layer.
16. The sensing structure of claim 1 wherein the external readout circuit comprises an analog-to-digital converter.
17. The sensing structure of claim 1 wherein the thermal coefficient of resistance is tuned to be ten times the response to temperature changes.
18. The sensing structure of claim 1 wherein the first and second strain sensors have the same gauge factor.
19. The sensing structure of claim 1 wherein the nanocomposite tunes the rate of change of conductivity with temperature.
20. The sensing structure of claim 1 wherein the first and second strain sensors are arranged on the sensor plate so that the strain on the first and second strain sensors are in opposite directions.