Spacer-containing tape
A spacer-containing tape for enabling the formation of a fine and uniform gap between various members and substrates for general purposes at low cost without the necessity of performing a spacer forming step specialized for each substrate or member on which spacers are to be disposed includes a spacer-dispersed layer containing at least a binder resin layer and a plurality of spacers. In this spacer-containing tape, the plurality of spacers are distributedly disposed independently from each other on one surface of the binder resin layer. It is preferable that the spacers be distributedly disposed regularly on the one surface of the binder resin layer. The area occupancy ratio of the spacers is preferably 35% or less.
1. A spacer-containing tape comprising a spacer-dispersed layer containing at least a binder resin layer and a plurality of spacers, wherein
the plurality of spacers are distributedly disposed independently from each other on one surface of the binder resin layer,
a surface of the binder resin layer in a vicinity of each of the spacers has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a center portion between adjacent spacers,
in the inclination, the surface of the binder resin layer around the spacer is lacked with respect to the tangent plane, and
in the undulation, a resin amount of the binder resin layer right above the spacer is smaller than that when the surface of the binder resin layer right above the spacer is flush with the tangent plane.
2. The spacer-containing tape according to claim 1 , wherein the spacers are distributedly disposed regularly on the one surface of the binder resin layer.
3. The spacer-containing tape according to claim 1 , wherein an area occupancy ratio of the spacers calculated by the following formula is 35% or less:
Area occupancy ratio of spacers (%)=[number density of spacers in plan view]×[average of plan view area per spacer]×100.
4. The spacer-containing tape according to claim 1 , wherein a ratio (Lb/D) between a distance Lb of a deepest portion of the spacer from the tangent plane and a particle diameter D of the spacers is 30% or more.
5. The spacer-containing tape according to claim 1 , wherein a ratio (La/D) between a layer thickness La of the binder resin layer and a particle diameter D of the spacers is 0.6 or more.
6. The spacer-containing tape according to claim 1 , wherein the spacers are disposed on one surface of the spacer-dispersed layer.
7. The spacer-containing tape according to claim 1 , wherein the spacers are disposed on both surfaces of the spacer-dispersed layer.
8. The spacer-containing tape according to claim 1 , wherein a resin layer containing no spacer is laminated on at least one surface of the spacer-dispersed layer.
9. The spacer-containing tape according to claim 1 , wherein the spacer itself is conductive or the tape further comprises conductive particles in addition to the spacers, and the spacer-containing tape functions as a vertically conductive tape that enables conduction between front and back surfaces of a film.
10. A method of producing a spacer-containing tape, comprising a step of forming a spacer-dispersed layer containing at least a binder resin layer and a plurality of spacers, wherein
the step of forming a spacer-dispersed layer has
a step of retaining a state in which spacers are dispersed on a surface of the binder resin layer, and
a step of pushing the spacers dispersed and retained on the surface of the binder resin layer into the binder resin layer, wherein a viscosity of the binder resin layer, a pushing speed, or a temperature when the spacers are pushed is adjusted such that a surface of the binder resin layer in a vicinity of each of the spacers has an inclination or an undulation with respect to a tangent plane of the binder resin layer in the center portion between adjacent spacers, and
in the inclination, the surface of the binder resin layer around the spacer is lacked with respect to the tangent plane; and in the undulation, a resin amount of the binder resin layer right above the spacer is smaller than that when the surface of the binder resin layer right above the spacer is flush with the tangent plane.
11. A bonded structure in which a first component and a second component are bonded with the spacer-containing tape according to claim 1 interposed therebetween.