Photosensitive resin composition and cured film

1. A negative-type photosensitive resin composition comprising a polyamide-imide resin containing a repeating unit represented by Chemical Formula 11 and a repeating unit represented by Chemical Formula 12, and a photoacid generator:

wherein, in the Chemical Formulae 11 and 12,

X is an aliphatic, alicyclic, or aromatic tetravalent organic group or a tetravalent organic group containing at least one heteroatom selected from the group consisting of N, O, and S,

Y is an aliphatic, alicyclic, or aromatic divalent organic group, or a divalent organic group containing at least one heteroatom selected from the group consisting of N, O, and S, and

n and m are each an integer of 1 or more,

wherein Q 1 and Q 2 each include a divalent functional group represented by Chemical Formula 13,

wherein, in the Chemical Formula 13,

L 1 is a single bond, —O—, —CO—, —S—, —SO 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —CONH—, —COO—, —(CH 2 ) n1 —, —O(CH 2 ) n2 O—, —OCH 2 —C(CH 3 ) 2 —CH 2 O—, or —OCO(CH 2 ) n3 OCO—,

n1, n2, and n3 are each an integer of 1 to 10,

R 1 and R 2 are the same as or different from each other, and are hydrogen, a halogen, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, or a carboxyl group,

p and q are an integer of 1 to 4,

at least one of R 1 and R 2 is a hydroxyl group or a carboxyl group, and

the remaining thereof is a functional group

comprising a structure formed from a reaction of a hydroxyl group or a carboxyl group substituted in the aromatic ring with one of compounds represented by Chemical Formulae 15 to 16,

2. The negative-type photosensitive resin composition according to claim 1 , wherein X includes a tetravalent functional group of the following Chemical Formula 4:

wherein, in Chemical Formula 4, A is a single bond, —O—, —CO—, —S—, —SO 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —CONH—, —COO—, —(CH 2 ) n1 —, —O(CH 2 ) n2 O—, or —OCO(CH 2 ) n3 OCO—, and n1, n2, and n3 are each an integer of 1 to 10.

3. The negative-type photosensitive resin composition according to claim 1 , further comprising a photo-curable polyfunctional acrylic compound.

4. A film comprising a cured product of the photosensitive resin composition of claim 1 .

5. A method for preparing a film comprising a step of curing the photosensitive resin composition of claim 1 at a temperature of 250° C. or less.

6. A method for forming a resist pattern comprising the steps of:

forming a resist film on a substrate using the photosensitive resin composition of claim 1 ;

irradiating the resist film in a pattern using a high energy ray, and

developing the resist film using an alkali developing solution.